Song; Gyu Seok

Patent Applications and Registrations

Patent applications and USPTO patent grants for Song; Gyu Seok.The latest application filed is for "adhesive film for semiconductor device".

Company Profile

1.7.11

Song; Gyu Seok - Uiwang-si KR
SONG; Gyu Seok - Suwon-si KR
Song; Gyu Seok - Hwaseong-si KR
Song; Gyu-Seok - Sungdong-gu KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Thermosetting composition for organic light-emitting element filler and organic light-emitting element display device comprising same Grant 9,887,382 - Kim , et al. February 6, 2	2018-02-06
Adhesive Film For Semiconductor Device App 20160075920 - UH; Dong Seon ; et al.	2016-03-17
Adhesive film for heat dissipation, semiconductor device including the same, and method of fabricating the semiconductor device Grant 9,240,364 - Park , et al. January 19, 2	2016-01-19
Thermosetting Composition For Organic Light-emitting Element Filler And Organic Light-emitting Element Display Device Comprising Same App 20160005995 - KIM; Mi Sun ; et al.	2016-01-07
Adhesive film and electronic device including the same Grant 9,169,425 - Kim , et al. October 27, 2	2015-10-27
Adhesive Film For Heat Dissipation, Semiconductor Device Including The Same, And Method Of Fabricating The Semiconductor Device App 20140353848 - PARK; Baek Soung ; et al.	2014-12-04
Adhesive Film And Electronic Device Including The Same App 20130154125 - KIM; Hye Jin ; et al.	2013-06-20
Multi-function tape for a semiconductor package and method of manufacturing a semiconductor device using the same Grant 8,309,219 - Hwang , et al. November 13, 2	2012-11-13
Adhesive Film For Semiconductor Device App 20120141786 - UH; Dong Seon ; et al.	2012-06-07
Attach Film Composition For Semiconductor Assembly And Attach Film Using The Same App 20110159294 - Song; Gyu Seok ; et al.	2011-06-30
Multi-function Tape For A Semiconductor Package And Method Of Manufacturing A Semiconductor Device Using The Same App 20100330780 - HWANG; Yong Ha ; et al.	2010-12-30
Photocurable composition for the formation of pressure-sensitive adhesive layer and dicing tape produced using the same App 20090075008 - Hwang; Yong Ha ; et al.	2009-03-19
Composition for pressure sensitive adhesive film, pressure sensitive adhesive film, and dicing die bonding film including the same App 20080160300 - Hwang; Yong Ha ; et al.	2008-07-03
Method for calculating parameters in road design of S-type clothoid, complex clothoid and egg type clothoid Grant 7,010,412 - Song March 7, 2	2006-03-07

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