SONG; Byeung Soo

Patent Applications and Registrations

Patent applications and USPTO patent grants for SONG; Byeung Soo.The latest application filed is for "fabrication method of semiconductor die and chip-on-plastic packaging of semiconductor die".

Company Profile

2.3.5

SONG; Byeung Soo - Sejong-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Fabrication Method Of Semiconductor Die And Chip-on-plastic Packaging Of Semiconductor Die App 20220278064 - JEONG; Jin Won ; et al.	2022-09-01
Fabrication method of semiconductor die and chip-on-plastic packaging of semiconductor die Grant 11,380,640 - Jeong , et al. July 5, 2	2022-07-05
Semiconductor Die Forming And Packaging Method Using Ultrashort Pulse Laser Micromachining App 20210407854 - JEONG; Jin Won ; et al.	2021-12-30
Fabrication Method Of Semiconductor Die And Chip-on-plastic Packaging Of Semiconductor Die App 20210296271 - JEONG; Jin Won ; et al.	2021-09-23
Method of forming and packaging semiconductor die Grant 10,910,270 - Choi , et al. February 2, 2	2021-02-02
Method Of Forming And Packaging Semiconductor Die App 20200312715 - CHOI; Jae Sik ; et al.	2020-10-01
Semiconductor package and method of manufacturing semiconductor package Grant 10,741,521 - Choi , et al. A	2020-08-11
Semiconductor Package And Method Of Manufacturing Semiconductor Package App 20200035644 - CHOI; Jae Sik ; et al.	2020-01-30

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