SON; Soo Hwan

Patent Applications and Registrations

Patent applications and USPTO patent grants for SON; Soo Hwan.The latest application filed is for "multilayer capacitor and board having the same".

Company Profile

39.59.71

SON; Soo Hwan - Suwon-si KR
Son; Soo Hwan - Suwon KR
Son; Soo Hwan - Gyunggi-Do KR
Son; Soo Hwan - Seoul KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multilayer Capacitor And Board Having The Same App 20220181084 - BYUN; Man Su ; et al.	2022-06-09
Composite electronic component Grant 11,328,871 - Son May 10, 2	2022-05-10
Composite electronic component Grant 11,322,306 - Son May 3, 2	2022-05-03
Composite electronic component Grant 11,289,275 - Son March 29, 2	2022-03-29
Electronic component Grant 11,276,528 - Byun , et al. March 15, 2	2022-03-15
Multilayer Ceramic Electronic Component App 20220051854 - KWON; Yeong Lim ; et al.	2022-02-17
Composite electronic component and board having the same Grant 11,206,737 - Byun , et al. December 21, 2	2021-12-21
Composite electronic component and board having the same Grant 11,166,375 - Byun , et al. November 2, 2	2021-11-02
Composite electronic component and board having the same Grant 11,094,461 - Son , et al. August 17, 2	2021-08-17
Multi-layered ceramic capacitor Grant 11,087,923 - Son , et al. August 10, 2	2021-08-10
Composite electronic component Grant 11,043,333 - Son , et al. June 22, 2	2021-06-22
Electronic Component App 20210175019 - Byun; Man Su ; et al.	2021-06-10
Composite Electronic Component App 20210159017 - SON; Soo Hwan	2021-05-27
Composite Electronic Component App 20210159015 - SON; Soo Hwan	2021-05-27
Composite Electronic Component App 20210159016 - SON; Soo Hwan	2021-05-27
Electronic Component App 20210092847 - Ji; Gu Won ; et al.	2021-03-25
Hybrid inductor and manufacturing method thereof Grant 10,937,581 - Kim , et al. March 2, 2	2021-03-02
Multilayer electronic component and board having the same mounted thereon Grant 10,910,163 - Jeong , et al. February 2, 2	2021-02-02
Complex electronic component Grant 10,777,351 - Son , et al. Sept	2020-09-15
Multilayer capacitor Grant 10,770,235 - Sim , et al. Sep	2020-09-08
Multilayer electronic component Grant 10,770,237 - Son , et al. Sep	2020-09-08
Electronic component Grant 10,748,707 - Son , et al. A	2020-08-18
Composite Electronic Component And Board Having The Same App 20200253057 - Kind Code	2020-08-06
Laminated electronic component and circuit board for mounting the same Grant 10,714,265 - Son , et al.	2020-07-14
Electronic components Grant 10,707,023 - Kim , et al.	2020-07-07
Composite Electronic Component And Board Having The Same App 20200211770 - SON; Soo Hwan ; et al.	2020-07-02
Composite electronic component and board having the same Grant 10,699,846 - Jeong , et al.	2020-06-30
Multi-layered Ceramic Capacitor App 20200143989 - SON; Soo Hwan ; et al.	2020-05-07
Electronic Component App 20200126720 - SON; Soo Hwan ; et al.	2020-04-23
Composite electronic component and board having the same Grant 10,629,374 - Son , et al.	2020-04-21
Composite electronic component and board having the same Grant 10,622,147 - Son , et al.	2020-04-14
Composite Electronic Component App 20200105474 - SON; Soo Hwan ; et al.	2020-04-02
Composite Electronic Component And Board Having The Same App 20200092999 - BYUN; Man Su ; et al.	2020-03-19
Electronic components Grant 10,593,484 - Kim , et al.	2020-03-17
Multilayer capacitor, method of manufacturing the same, and board having the same Grant 10,553,361 - Son , et al. Fe	2020-02-04
Multilayer electronic component and board having the same Grant 10,542,626 - Kim , et al. Ja	2020-01-21
Multilayer Electronic Component And Board Having The Same Mounted Thereon App 20200006003 - Jeong; Dae Heon ; et al.	2020-01-02
Composite electronic component and board having the same Grant 10,504,655 - Byun , et al. Dec	2019-12-10
Electronic Components App 20190355525 - KIM; Ho Yoon ; et al.	2019-11-21
Multilayer electronic component and board having the same Grant 10,460,875 - Park , et al. Oc	2019-10-29
Electronic component having multilayer capacitor, interposer, and adhesive layer Grant 10,446,323 - Son , et al. Oc	2019-10-15
Multilayer Capacitor App 20190279824 - SIM; Won Chul ; et al.	2019-09-12
Composite electronic component Grant 10,403,441 - Kim , et al. Sep	2019-09-03
Electronic Components App 20190259539 - KIM; Ho Yoon ; et al.	2019-08-22
Multilayer Electronic Component And Board Having The Same App 20190221369 - PARK; Heung Kil ; et al.	2019-07-18
Multilayer electronic component and board having the same Grant 10,347,425 - Park , et al. July 9, 2	2019-07-09
Multilayer Electronic Component App 20190198252 - SON; Soo Hwan ; et al.	2019-06-27
Multilayer Capacitor, Method Of Manufacturing The Same, And Board Having The Same App 20190198248 - SON; Soo Hwan ; et al.	2019-06-27
Composite electronic component Grant 10,332,680 - Kim , et al.	2019-06-25
Composite Electronic Component App 20190180945 - KIM; Ho Yoon ; et al.	2019-06-13
Composite electronic component and board having the same Grant 10,321,571 - Choi , et al.	2019-06-11
Laminated Electronic Component And Circuit Board For Mounting The Same App 20190172651 - SON; Soo Hwan ; et al.	2019-06-06
Hybrid Inductor And Manufacturing Method Thereof App 20190172618 - KIM; Ho Yoon ; et al.	2019-06-06
Composite Electronic Component And Board Having The Same App 20190157005 - SON; Soo Hwan ; et al.	2019-05-23
Multilayer ceramic capacitor and board having the same Grant 10,249,438 - Byun , et al.	2019-04-02
Ferrite and inductor including the same Grant 10,236,104 - Lee , et al.	2019-03-19
Multilayer Electronic Component And Board Having The Same App 20190069412 - KIM; Ho Yoon ; et al.	2019-02-28
Composite Electronic Component And Board Having The Same App 20190066919 - SON; Soo Hwan ; et al.	2019-02-28
Composite Electronic Component And Board Having The Same App 20190069410 - BYUN; Man Su ; et al.	2019-02-28
Composite Electronic Component And Board Having The Same App 20190066918 - JEONG; Dae Heon ; et al.	2019-02-28
Multilayer Electronic Component And Board Having The Same App 20180323010 - PARK; Heung Kil ; et al.	2018-11-08
Multilayer Ceramic Electronic Component And Board Having The Same Mounted Thereon App 20180240596 - SON; Soo Hwan	2018-08-23
Multilayer ceramic electronic component and board having the same mounted thereon Grant 10,056,193 - Son August 21, 2	2018-08-21
Composite electronic component and board having the same Grant 10,028,381 - Son , et al. July 17, 2	2018-07-17
Composite Electronic Component And Board Having The Same App 20180182558 - BYUN; Man Su ; et al.	2018-06-28
Composite electronic component and board having the same Grant 9,922,762 - Kim , et al. March 20, 2	2018-03-20
Multilayer electronic component, manufacturing method thereof, and board having the same mounted thereon Grant 9,894,768 - Kim , et al. February 13, 2	2018-02-13
Composite electronic component and board on which composite electronic component is mounted Grant 9,877,381 - Son January 23, 2	2018-01-23
Complex Electronic Component App 20170346279 - SON; Soo Hwan ; et al.	2017-11-30
Multilayer electronic component and conductive paste composition for internal electrode Grant 9,824,791 - Lee , et al. November 21, 2	2017-11-21
Composite electronic component and board for mounting thereof Grant 9,754,723 - Moon , et al. September 5, 2	2017-09-05
Composite Electronic Component App 20170236640 - KIM; Ho Yoon ; et al.	2017-08-17
Composite Electronic Component And Board Having The Same App 20170196092 - CHOI; Yu Jin ; et al.	2017-07-06
Composite electronic component and a board for mounting the same Grant 9,654,079 - Son , et al. May 16, 2	2017-05-16
Multilayer Electronic Component And Conductive Paste Composition For Internal Electrode App 20170103827 - LEE; Young Il ; et al.	2017-04-13
Composite Electronic Component And Board On Which Composite Electronic Component Is Mounted App 20170099727 - SON; Soo Hwan	2017-04-06
Multilayer electronic component and conductive paste composition for internal electrode Grant 9,576,697 - Lee , et al. February 21, 2	2017-02-21
Composite Electronic Component And Board Having The Same App 20170018373 - SON; Soo Hwan ; et al.	2017-01-19
Laminated Electronic Component And Circuit Board For Mounting The Same App 20170011854 - SON; Soo Hwan ; et al.	2017-01-12
Multi-layered chip electronic component Grant 9,536,647 - Hahn , et al. January 3, 2	2017-01-03
Composite electronic component and board having the same Grant 9,532,443 - Son , et al. December 27, 2	2016-12-27
Multilayer coil component Grant 9,530,554 - Son , et al. December 27, 2	2016-12-27
Hybrid Inductor And Manufacturing Method Thereof App 20160293315 - KIM; Ho Yoon ; et al.	2016-10-06
Gap composition of multi layered power inductor and multi layered power inductor including gap layer using the same Grant 9,460,837 - Son , et al. October 4, 2	2016-10-04
Composite electronic component and board with the same mounted thereon Grant 9,390,862 - Moon , et al. July 12, 2	2016-07-12
Composite Electronic Component App 20160181011 - CHOI; Yu Jin ; et al.	2016-06-23
Inductor Array Chip And Board Having The Same App 20160078997 - SON; Soo Hwan ; et al.	2016-03-17
Composite Electronic Component, Board Having The Same, And Packaging Unit Thereof App 20160042872 - CHOI; Yu Jin ; et al.	2016-02-11
Composite Electronic Component And Board Having The Same App 20160014886 - KIM; Ho Yoon ; et al.	2016-01-14
Composite Electronic Component And Board Having The Same App 20160007439 - SON; Soo Hwan ; et al.	2016-01-07
Composite Electronic Component And Board For Mounting Thereof App 20150371780 - MOON; Byeong Cheol ; et al.	2015-12-24
Multilayer Electronic Component And Conductive Paste Composition For Internal Electrode App 20150371728 - LEE; Young Il ; et al.	2015-12-24
Multilayer coil component Grant 9,147,517 - Son , et al. September 29, 2	2015-09-29
Ferrite composition for high frequency bead and chip bead comprising the same Grant 9,123,460 - An , et al. September 1, 2	2015-09-01
Composite Electronic Component And Board With The Same Mounted Thereon App 20150213960 - Moon; Byeong Cheol ; et al.	2015-07-30
Multilayer Electronic Component, Manufacturing Method Thereof, And Board Having The Same Mounted Thereon App 20150155084 - KIM; Ic Seob ; et al.	2015-06-04
Multilayer inductor and method of manufacturing the same Grant 9,041,506 - Kim , et al. May 26, 2	2015-05-26
Composite Electronic Component And A Board For Mounting The Same App 20150109074 - SON; Soo Hwan ; et al.	2015-04-23
Ferrite And Inductor Including The Same App 20150022305 - Lee; Young II ; et al.	2015-01-22
Magnetic layer composition, multilayer type coil component, and method for manufacturing the same Grant 8,890,647 - Moon , et al. November 18, 2	2014-11-18
Coil Element And Method For Manufacturing The Same App 20140191837 - MOON; Byeong Cheol ; et al.	2014-07-10
Multilayer Coil Component App 20140139308 - SON; Soo Hwan ; et al.	2014-05-22
Multilayer Coil Component App 20140139309 - SON; Soo Hwan ; et al.	2014-05-22
Multi-layered chip electronic component Grant 8,729,999 - Hahn , et al. May 20, 2	2014-05-20
Multi-layered Chip Electronic Component App 20140062643 - Hahn; Jin Woo ; et al.	2014-03-06
Multi-layered Chip Electronic Component App 20130335185 - HAHN; Jin Woo ; et al.	2013-12-19
Magnetic material composition for ceramic electronic component, method of manufacturing the same, and ceramic electronic component using the same Grant 8,597,534 - An , et al. December 3, 2	2013-12-03
Multilayer type power inductor Grant 8,576,040 - Kim , et al. November 5, 2	2013-11-05
Multilayered Ceramic Electronic Component And Method Of Fabricating The Same App 20130120905 - Son; Soo Hwan ; et al.	2013-05-16
Multilayer Inductor And Method Of Manufacturing The Same App 20130027168 - KIM; Myeong Gi ; et al.	2013-01-31
Magnetic Layer Composition, Multilayer Type Coil Component, And Method For Manufacturing The Same App 20130009742 - Moon; Byeong Cheol ; et al.	2013-01-10
Gap Composition Of Multi Layered Power Inductor And Multi Layered Power Inductor Including Gap Layer Using The Same App 20130002389 - SON; Soo Hwan ; et al.	2013-01-03
Multilayered Power Inductor And Method For Preparing The Same App 20130002391 - KIM; Ic Seob ; et al.	2013-01-03
Multilayer Type Power Inductor App 20120268230 - KIM; Myeong Gi ; et al.	2012-10-25
Laminated Inductor And Method Of Manufacturing The Same App 20120169444 - Son; Soo Hwan ; et al.	2012-07-05
Nano Glass Powder For Sintering Additive And Method For Fabricating The Same App 20120138215 - KIM; Ic Seob ; et al.	2012-06-07
Magnetic Material Composition For Ceramic Electronic Component, Method Of Manufacturing The Same, And Ceramic Electronic Component Using The Same App 20120132847 - AN; SUNG YONG ; et al.	2012-05-31
Magnetic Material Composition For Ceramic Electronic Component, Method Of Manufacturing The Same, And Ceramic Electronic Component Using The Same App 20120126165 - AN; Sung Yong ; et al.	2012-05-24
Non-magnetic Material Composition For Ceramic Electronic Component, Ceramic Electronic Component Manufactured By Using The Same, And Method Of Manufacturing The Ceramic Electronic Component App 20120119866 - KIM; Ic Seob ; et al.	2012-05-17
Ferrite Composition For High Frequency Bead And Chip Bead Comprising The Same App 20120085963 - AN; Sung Yong ; et al.	2012-04-12
Layered Inductor And Manufacturing Method Thereof App 20120056705 - KIM; Sung Lyoung ; et al.	2012-03-08
Multilayer Inductor And Method Of Manufacturing The Same App 20120013429 - Kim; Sung Lyoung ; et al.	2012-01-19