loadpatents
name:-0.0079629421234131
name:-0.0034699440002441
name:-0.001910924911499
SON; Seongmin Patent Filings

SON; Seongmin

Patent Applications and Registrations

Patent applications and USPTO patent grants for SON; Seongmin.The latest application filed is for "method of fabricating a semiconductor device".

Company Profile
1.5.8
  • SON; Seongmin - Hwaseong-si KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method Of Fabricating A Semiconductor Device
App 20220068852 - CHOI; Ju-Il ;   et al.
2022-03-03
Semiconductor Package For Improving Bonding Reliability
App 20220037273 - Park; Jaehyung ;   et al.
2022-02-03
Semiconductor Packages
App 20220013502 - Lee; Kyuha ;   et al.
2022-01-13
Semiconductor device including interconnection structure including copper and tin and semiconductor package including the same
Grant 11,152,317 - Choi , et al. October 19, 2
2021-10-19
Semiconductor Device And Semiconductor Package Including The Same
App 20200098711 - CHOI; Ju-Il ;   et al.
2020-03-26
Semiconductor devices having through-electrodes and methods for fabricating the same
Grant 9,847,276 - Kang , et al. December 19, 2
2017-12-19
Semiconductor devices including through silicon via electrodes and methods of fabricating the same
Grant 9,153,559 - Lee , et al. October 6, 2
2015-10-06
Semiconductor Devices Having Through-electrodes And Methods For Fabricating The Same
App 20150137326 - KANG; Pil-Kyu ;   et al.
2015-05-21
Semiconductor Devices Including Through Silicon Via Electrodes And Methods Of Fabricating The Same
App 20130127019 - LEE; Dosun ;   et al.
2013-05-23

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