Son; Seong Min

Patent Applications and Registrations

Patent applications and USPTO patent grants for Son; Seong Min.The latest application filed is for "hybrid vehicle control method".

Company Profile

8.11.19

Son; Seong Min - Pohang KR
Son; Seong Min - Pohang-Si KR
SON; Seong-min - Hwaseong-si KR
Son; Seong-min - Hwasung-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Hybrid Vehicle Control Method App 20220307526 - Bae; Bong Uk ; et al.	2022-09-29
Method Of Controlling Eop Of Powertrain Of Vehicle App 20220268353 - Choi; Sung Sik ; et al.	2022-08-25
Method Of Controlling Eop Of Hybrid Vehicle App 20220268352 - JO; Se Hwan ; et al.	2022-08-25
Powertrain-cooling System Of Hybrid Vehicle App 20220268355 - JO; Se Hwan ; et al.	2022-08-25
Semiconductor Chip App 20220108962 - JIN; Jeong-gi ; et al.	2022-04-07
Semiconductor chip Grant 11,251,144 - Jin , et al. February 15, 2	2022-02-15
Hydraulic pressure control method for transmission Grant 11,168,785 - Bae , et al. November 9, 2	2021-11-09
Semiconductor Device App 20210005565 - SON; Seong-Min ; et al.	2021-01-07
Semiconductor device Grant 10,833,032 - Son , et al. November 10, 2	2020-11-10
Semiconductor devices and semiconductor packages including the same, and methods of manufacturing the semiconductor devices Grant 10,580,726 - Chun , et al.	2020-03-03
Semiconductor Chip App 20200066666 - Jin; Jeong-gi ; et al.	2020-02-27
Semiconductor chip Grant 10,483,224 - Jin , et al. Nov	2019-11-19
Semiconductor Devices And Semiconductor Packages Including The Same, And Methods Of Manufacturing The Semiconductor Devices App 20190131228 - CHUN; Jin-Ho ; et al.	2019-05-02
Semiconductor Device App 20190067228 - SON; Seong-Min ; et al.	2019-02-28
Semiconductor Chip App 20180138137 - JIN; Jeong-gi ; et al.	2018-05-17
Integrated circuit device having through-silicon-via structure Grant 9,496,218 - Lee , et al. November 15, 2	2016-11-15
Methods Of Manufacturing Semiconductor Devices App 20160163590 - Jung; Deokyoung ; et al.	2016-06-09
Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same Grant 9,064,941 - Jung , et al. June 23, 2	2015-06-23
Semiconductor Packages, Methods Of Manufacturing The Same, And Semiconductor Package Structures Including The Same App 20150132950 - JUNG; Deok-young ; et al.	2015-05-14
Semiconductor devices having through silicon vias and methods of fabricating the same Grant 9,006,902 - Choi , et al. April 14, 2	2015-04-14
Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same Grant 8,963,336 - Jung , et al. February 24, 2	2015-02-24
Semiconductor Packages, Methods Of Manufacturing The Same, And Semiconductor Package Structures Including The Same App 20140327150 - JUNG; Deok-young ; et al.	2014-11-06
Semiconductor Devices Having Through Silicon Vias and Methods of Fabricating the Same App 20140217559 - CHOI; JU-IL ; et al.	2014-08-07
Semiconductor Device Including Tsv And Semiconductor Package Including The Same App 20140138819 - Choi; Ju-il ; et al.	2014-05-22
Integrated Circuit Device Having Through-Silicon-Via Structure and Method of Manufacturing the Same App 20140021633 - Lee; Do-Sun ; et al.	2014-01-23

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