SON; Joonseo

Patent Applications and Registrations

Patent applications and USPTO patent grants for SON; Joonseo.The latest application filed is for "integrated circuit direct cooling systems and related methods".

Company Profile

5.8.11

SON; Joonseo - Seoul KR
Son; JoonSeo - Mapo Gu KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated Circuit Direct Cooling Systems And Related Methods App 20220093487 - IM; Seungwon ; et al.	2022-03-24
Semiconductor package having a spacer with a junction cooling pipe Grant 11,201,105 - Im , et al. December 14, 2	2021-12-14
Semiconductor Package And Related Methods App 20210265318 - IM; Seungwon ; et al.	2021-08-26
Power Module Package And Method Of Manufacturing The Same Related Application App 20210265175 - LEE; Keunhyuk ; et al.	2021-08-26
Semiconductor die package including a one-body clip Grant 11,101,198 - Im , et al. August 24, 2	2021-08-24
Semiconductor package and related methods Grant 11,037,907 - Im , et al. June 15, 2	2021-06-15
Semiconductor Die Package Including A One-body Clip App 20200194346 - IM; Seungwon ; et al.	2020-06-18
Integrated Circuit Direct Cooling Systems And Related Methods App 20200185305 - IM; Seungwon ; et al.	2020-06-11
Semiconductor package having junction cooling pipes embedded in substrates Grant 10,607,919 - Im , et al.	2020-03-31
Semiconductor die package and manufacturing method Grant 10,586,754 - Im , et al.	2020-03-10
Semiconductor Package And Related Methods App 20190348399 - IM; Seungwon ; et al.	2019-11-14
Semiconductor package and related methods Grant 10,403,601 - Im , et al. Sep	2019-09-03
Integrated Circuit Direct Cooling Systems And Related Methods App 20180315681 - IM; Seungwon ; et al.	2018-11-01
Stray inductance reduction in packaged semiconductor devices and modules Grant 10,090,279 - Im , et al. October 2, 2	2018-10-02
Stray Inductance Reduction In Packaged Semiconductor Devices And Modules App 20180254262 - IM; Seungwon ; et al.	2018-09-06
Semiconductor Die Package And Manufacturing Method App 20180122725 - IM; Seungwon ; et al.	2018-05-03
Semiconductor Package And Related Methods App 20170365583 - IM; Seungwon ; et al.	2017-12-21
Wireless semiconductor package for efficient heat dissipation Grant 7,586,179 - Calo , et al. September 8, 2	2009-09-08
Wireless Semiconductor Package For Efficient Heat Dissipation App 20090091010 - Calo; Paul Armand ; et al.	2009-04-09

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