Son; Joon Seo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Son; Joon Seo.The latest application filed is for "molded semiconductor package having a substrate with bevelled edge".

Company Profile

1.20.24

Son; Joon Seo - Seoul KR
Son; Joon-seo - Gangseo-gu KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Molded Semiconductor Package Having A Substrate With Bevelled Edge App 20220285239 - Jong; Man Kyo ; et al.	2022-09-08
Power module package Grant 11,004,698 - Lee , et al. May 11, 2	2021-05-11
Semiconductor package Grant 9,666,512 - Im , et al. May 30, 2	2017-05-30
Semiconductor Package App 20150332992 - IM; Seung-won ; et al.	2015-11-19
Power module having stacked flip-chip and method for fabricating the power module Grant 9,130,065 - Im , et al. September 8, 2	2015-09-08
Power Module Package And Method Of Manufacturing The Same App 20150103498 - Lee; Keunhyuk ; et al.	2015-04-16
Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the package Grant 8,945,992 - Son , et al. February 3, 2	2015-02-03
Semiconductor package and method of fabricating the same Grant 8,860,196 - Eom , et al. October 14, 2	2014-10-14
Power Module Having Stacked Flip-Chip and Method for Fabricating the Power Module App 20140273349 - Lim; Seung-won ; et al.	2014-09-18
Power module having stacked flip-chip and method of fabricating the power module Grant 8,766,419 - Lim , et al. July 1, 2	2014-07-01
Semiconductor package and methods of fabricating the same Grant 8,723,304 - Kang , et al. May 13, 2	2014-05-13
Semiconductor Package And Method Of Fabricating The Same App 20130307145 - CHUNG; Yoon-jae ; et al.	2013-11-21
Power device packages having thermal electric modules using peltier effect and methods of fabricating the same Grant 8,552,541 - Lim , et al. October 8, 2	2013-10-08
Semiconductor Package And Method Of Fabricating The Same App 20120168919 - EOM; Joo-Yang ; et al.	2012-07-05
Power Device Package Comprising Metal Tab Die Attach Paddle (dap) And Method Of Fabricating The Package App 20120034741 - Son; Joon-seo ; et al.	2012-02-09
Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the package Grant 8,067,826 - Son , et al. November 29, 2	2011-11-29
Power Device Packages Having Thermal Electric Modules Using Peltier Effect And Methods Of Fabricating The Same App 20110204500 - Lim; Seung-won ; et al.	2011-08-25
Power Device Packages And Methods Of Fabricating The Same App 20110076804 - Jong; Man-kyo ; et al.	2011-03-31
Power device packages and methods of fabricating the same Grant 7,863,725 - Jong , et al. January 4, 2	2011-01-04
Power quad flat no-lead semiconductor die packages with isolated heat sink for high-voltage, high-power applications, systems using the same, and methods of making the same Grant 7,816,784 - Son , et al. October 19, 2	2010-10-19
Power Module Having Stacked Flip-Chip and Method of Fabricating the Power Module App 20100155914 - Lim; Seung-won ; et al.	2010-06-24
Power Quad Flat No-lead Semiconductor Die Packages With Isolated Heat Sink For High-voltage, High-power Applications, Systems Using The Same, And Methods Of Making The Same App 20100148328 - Son; Joon-Seo ; et al.	2010-06-17
Semiconductor packages and methods of fabricating the same Grant 7,714,455 - Son , et al. May 11, 2	2010-05-11
Power module and method of fabricating the same Grant 7,687,903 - Son , et al. March 30, 2	2010-03-30
Power module having stacked flip-chip and method of fabricating the power module Grant 7,675,148 - Lim , et al. March 9, 2	2010-03-09
Semiconductor device package App 20090243079 - Lim; Seung-won ; et al.	2009-10-01
Power Device Packages Having Thermal Electric Modules Using Peltier Effect and Methods of Fabricating the Same App 20090243078 - Lim; Seung-won ; et al.	2009-10-01
Power Device Substrates and Power Device Packages Including the Same App 20090244848 - Lim; Seung-won ; et al.	2009-10-01
Semiconductor Package And Methods Of Fabricating The Same App 20090194859 - Kang; In-goo ; et al.	2009-08-06
Semiconductor Package And Method Of Fabricating The Same App 20090127681 - Son; Joon-seo ; et al.	2009-05-21
Power Device Packages and Methods of Fabricating the Same App 20090127685 - Jong; Man-kyo ; et al.	2009-05-21
Power module and method of fabricating the same App 20090129028 - Son; Joon-seo ; et al.	2009-05-21
Semiconductor Packages and Methods of Fabricating the Same App 20090115038 - Son; Joon-seo ; et al.	2009-05-07
Power module having stacked flip-chip and method of fabricating the power module App 20080224285 - Lim; Seung-won ; et al.	2008-09-18
Power Device Package Comprising Metal Tab Die Attach Paddle (dap) And Method Of Fabricating The Package App 20080164589 - Son; Joon-seo ; et al.	2008-07-10
Semiconductor Package Suitable For High Voltage Applications App 20070181984 - Son; Joon-seo ; et al.	2007-08-09
Semiconductor package suitable for high voltage applications Grant 7,199,461 - Son , et al. April 3, 2	2007-04-03
Semiconductor package suitable for high voltage applications App 20040232541 - Son, Joon-seo ; et al.	2004-11-25
Discrete package having insulated ceramic heat sink App 20040061206 - Son, Joon-Seo ; et al.	2004-04-01

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.