SON; Jae Yeol

Patent Applications and Registrations

Patent applications and USPTO patent grants for SON; Jae Yeol.The latest application filed is for "lead-free solder alloy, solder paste comprising the same, and semiconductor device comprising the same".

Company Profile

0.1.8

SON; Jae Yeol - Yongin-si KR
SON; Jae Yeol - Cheoin-gu KR
SON; Jae Yeol - Gyeonggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Lead-free Solder Alloy, Solder Paste Comprising The Same, And Semiconductor Device Comprising The Same App 20220212293 - SON; Jae Yeol ; et al.	2022-07-07
Pin-grid-array-type Semiconductor Package App 20210375811 - SON; Jae Yeol ; et al.	2021-12-02
Semiconductor Package Using Core Material For Reverse Reflow App 20210366858 - SON; Jae Yeol ; et al.	2021-11-25
Core For Reverse Reflow, Semiconductor Package, And Method Of Fabricating Semiconductor Package App 20160315040 - SON; Jae Yeol ; et al.	2016-10-27
Lead-free Solder Having Low Melting Point App 20160256962 - KIM; Hui Joong ; et al.	2016-09-08
Solder Ball For Fluxless Bonding, Method Of Manufacturing The Same, And Method Of Forming Solder Bump App 20160244891 - SON; Jae Yeol ; et al.	2016-08-25
Solder balls and semiconductor device employing the same Grant 9,391,039 - Moon , et al. July 12, 2	2016-07-12
Solder Balls And Semiconductor Device Employing The Same App 20150380373 - MOON; Jeong Tak ; et al.	2015-12-31
Metal Ball Fabricating Apparatus App 20150064293 - MOON; Jeong Tak ; et al.	2015-03-05

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