SON; Jae Hyun

Patent Applications and Registrations

Patent applications and USPTO patent grants for SON; Jae Hyun.The latest application filed is for "systems and method for workflow editing".

Company Profile

4.16.14

SON; Jae Hyun - Seoul KR
Son; Jae Hyun - Gwangju-si KR
SON; Jae Hyun - Gwangju-si Gyeonggi-do KR
Son; Jae Hyun - Gwangju N/A KR
Son; Jae-hyun - Gyeonggi-do KR
Son; Jae Hyun - Ichon-si KR
Son; Jae Hyun - Kyoungki-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Systems And Method For Workflow Editing App 20220156654 - SON; Jae Hyun	2022-05-19
Systems And Methods For Managing Event Storage App 20220129477 - SON; Jae Hyun	2022-04-28
Semiconductor packages including a heat insulation wall Grant 11,270,923 - Kang , et al. March 8, 2	2022-03-08
Systems and methods for managing event storage Grant 11,256,714 - Son February 22, 2	2022-02-22
Systems and method for workflow editing Grant 11,080,636 - Son August 3, 2	2021-08-03
Semiconductor Packages Including A Heat Insulation Wall App 20200185298 - KANG; Min Kyu ; et al.	2020-06-11
Semiconductor packages including a heat insulation wall Grant 10,600,713 - Kang , et al.	2020-03-24
Semiconductor Packages Including A Heat Insulation Wall App 20190131203 - KANG; Min Kyu ; et al.	2019-05-02
Semiconductor chip and stacked type semiconductor package having the same Grant 9,390,997 - Kim , et al. July 12, 2	2016-07-12
Semiconductor Chip And Stacked Type Semiconductor Package Having The Same App 20150008588 - KIM; Jong Hoon ; et al.	2015-01-08
Stack package and method for selecting chip in stack package Grant 8,810,309 - Lee , et al. August 19, 2	2014-08-19
Stack package having flexible conductors Grant 8,680,688 - Kang , et al. March 25, 2	2014-03-25
Opener and buffer table for test handler Grant 8,523,158 - Na , et al. September 3, 2	2013-09-03
Insert for carrier board of test handler Grant 8,496,113 - Na , et al. July 30, 2	2013-07-30
Phase-change Random Access Memory Device And Method Of Manufacturing The Same App 20130015421 - SIM; Joon Seop ; et al.	2013-01-17
Stack Package Having Flexible Conductors App 20130001779 - KANG; Tae Min ; et al.	2013-01-03
Stack package having flexible conductors Grant 8,288,873 - Kang , et al. October 16, 2	2012-10-16
Stack Package And Method For Selecting Chip In Stack Package App 20120154020 - LEE; Dae Woong ; et al.	2012-06-21
Stack semiconductor package and method for manufacturing the same Grant 8,164,200 - Kang , et al. April 24, 2	2012-04-24
Printed circuit board provided with heat circulating medium and method for manufacturing the same Grant 8,044,301 - Son October 25, 2	2011-10-25
Stack Package Having Flexible Conductors App 20110254167 - KANG; Tae Min ; et al.	2011-10-20
Stack Semiconductor Package And Method For Manufacturing The Same App 20110121454 - KANG; Tae Min ; et al.	2011-05-26
Opener And Buffer Table For Test Handler App 20100320348 - Na; Yun-Sung ; et al.	2010-12-23
Adjustable Cooling Unit For Semiconductor Module App 20090065187 - SON; Jae Hyun	2009-03-12
Printed Circuit Board Provided With Heat Circulating Medium And Method For Manufacturing The Same App 20080286531 - SON; Jae Hyun	2008-11-20

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