SON; Il-Seok

Patent Applications and Registrations

Patent applications and USPTO patent grants for SON; Il-Seok.The latest application filed is for "wrap-around source/drain method of making contacts for backside metals".

Company Profile

8.9.11

SON; Il-Seok - Portland OR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wrap-around Source/drain Method Of Making Contacts For Backside Metals App 20220140127 - MORROW; Patrick ; et al.	2022-05-05
Wrap-around Source/drain Method Of Making Contacts For Backside Metals App 20220140128 - MORROW; Patrick ; et al.	2022-05-05
Wrap-around source/drain method of making contacts for backside metals Grant 11,264,493 - Morrow , et al. March 1, 2	2022-03-01
Techniques For Revealing A Backside Of An Integrated Circuit Device, And Associated Configurations App 20210104435 - SON; Il-Seok ; et al.	2021-04-08
Techniques for revealing a backside of an integrated circuit device, and associated configurations Grant 10,896,847 - Son , et al. January 19, 2	2021-01-19
Methods of forming backside self-aligned vias and structures formed thereby Grant 10,797,139 - Morrow , et al. October 6, 2	2020-10-06
Techniques For Revealing A Backside Of An Integrated Circuit Device, And Associated Configurations App 20190371666 - SON; Il-Seok ; et al.	2019-12-05
Techniques for revealing a backside of an integrated circuit device, and associated configurations Grant 10,490,449 - Son , et al. Nov	2019-11-26
Methods Of Forming Backside Self-aligned Vias And Structures Formed Thereby App 20190326405 - Morrow; Patrick ; et al.	2019-10-24
Methods of forming backside self-aligned vias and structures formed thereby Grant 10,367,070 - Morrow , et al. July 30, 2	2019-07-30
Partial layer transfer system and method Grant 10,236,282 - Morrow , et al.	2019-03-19
Methods Of Forming Backside Self-aligned Vias And Structures Formed Thereby App 20180248012 - Morrow; Patrick ; et al.	2018-08-30
Techniques For Revealing A Backside Of An Integrated Circuit Device, And Associated Configurations App 20180233409 - SON; Il-Seok ; et al.	2018-08-16
Wrap-around Source/drain Method Of Making Contacts For Backside Metals App 20180219090 - MORROW; Patrick ; et al.	2018-08-02
Methods of forming under device interconnect structures Grant 9,721,898 - Morrow , et al. August 1, 2	2017-08-01
Methods of forming under device interconnect structures Grant 9,490,201 - Morrow , et al. November 8, 2	2016-11-08
Partial Layer Transfer System And Method App 20160233206 - MORROW; PATRICK ; et al.	2016-08-11
Methods Of Forming Under Device Interconnect Structures App 20140264739 - Morrow; Patrick ; et al.	2014-09-18

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