loadpatents
name:-0.0039918422698975
name:-0.0031189918518066
name:-0.0025839805603027
Soman; Joel Patent Filings

Soman; Joel

Patent Applications and Registrations

Patent applications and USPTO patent grants for Soman; Joel.The latest application filed is for "piezoeletric wet etch process with reduced resist lifting and controlled undercut".

Company Profile
2.6.7
  • Soman; Joel - Dallas TX
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method of forming a semiconductor device
Grant 10,319,899 - Jiang , et al.
2019-06-11
Method to reduce frequency distribution of bulk acoustic wave resonators during manufacturing
Grant 10,135,415 - Soman , et al. November 20, 2
2018-11-20
High-temperature isotropic plasma etching process to prevent electrical shorts
Grant 9,939,710 - Jiang , et al. April 10, 2
2018-04-10
Piezoeletric Wet Etch Process With Reduced Resist Lifting And Controlled Undercut
App 20170338401 - Jiang; Neng ;   et al.
2017-11-23
Piezoeletric wet etch process with reduced resist lifting and controlled undercut
Grant 9,755,139 - Jiang , et al. September 5, 2
2017-09-05
Method To Reduce Frequency Distribution Of Bulk Acoustic Wave Resonators During Manufacturing
App 20170179914 - Soman; Joel ;   et al.
2017-06-22
High-temperature Isotropic Plasma Etching Process To Prevent Electrical Shorts
App 20160313627 - Jiang; Neng ;   et al.
2016-10-27
High-temperature isotropic plasma etching process to prevent electrical shorts
Grant 9,405,089 - Jiang , et al. August 2, 2
2016-08-02
Bond-pad integration scheme for improved moisture barrier and electrical contact
Grant 9,304,283 - Soman , et al. April 5, 2
2016-04-05
Method For Reducing Discharge Defects And Electrode Delamination In Piezoelectric Optical Mems Devices
App 20150376000 - Chang; YungShan ;   et al.
2015-12-31
Piezoeletric Wet Etch Process With Reduced Resist Lifting And Controlled Undercut
App 20150380637 - Jiang; Neng ;   et al.
2015-12-31
Bond-pad Integration Scheme For Improved Moisture Barrier And Electrical Contact
App 20150338604 - Soman; Joel ;   et al.
2015-11-26
High-temperature Isotropic Plasma Etching Process To Prevent Electrical Shorts
App 20150340245 - Jiang; Neng ;   et al.
2015-11-26

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