Sohn; Seung Hyun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sohn; Seung Hyun.The latest application filed is for "apparatus and method for controlling adaptive reclosing based on transient stability".

Company Profile

0.6.24

Sohn; Seung Hyun - Suwon-si KR
Sohn; Seung Hyun - Suwon KR
Sohn; Seung Hyun - Kyungki-do KR
Sohn; Seung Hyun - Gyeonggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Apparatus and method for controlling adaptive reclosing based on transient stability Grant 9,673,610 - Kim , et al. June 6, 2	2017-06-06
Apparatus And Method For Controlling Adaptive Reclosing Based On Transient Stability App 20150263506 - KIM; Chul Hwan ; et al.	2015-09-17
Piezoelectric device with piezoelectric polymer material Grant 9,105,844 - Kim , et al. August 11, 2	2015-08-11
Piezoelectric Device Of Polymer App 20130127299 - KIM; Woon Chun ; et al.	2013-05-23
Conductive Subtrate And Method Of Manufacturing The Same App 20130098668 - Kim; Woon Chun ; et al.	2013-04-25
Printed Circuit Board Having Electro-component And Manufacturing Method Thereof App 20120291274 - LEE; Jin-Won ; et al.	2012-11-22
Method of manufacturing PCB having electronic components embedded therein App 20120017435 - Sohn; Seung Hyun ; et al.	2012-01-26
Electro Device Embedded Printed Circuit Board And Manufacturng Method Thereof App 20110214913 - Lee; Jin-Won ; et al.	2011-09-08
Electro Device Embedded Printed Circuit Board And Manufacturing Method Thereof App 20110216515 - LEE; Jin-Won ; et al.	2011-09-08
Electronic Component Embedded Printed Circuit Board And Method Of Manufacturing The Same App 20110141711 - SOHN; Seung-Hyun ; et al.	2011-06-16
Printed Circuit Board Having Electro-component And Manufacturing Method Thereof App 20110116246 - LEE; Jin-Won ; et al.	2011-05-19
Thin film capacitor-embedded printed circuit board and method of manufacturing the same Grant 7,886,436 - Moon , et al. February 15, 2	2011-02-15
Composite Dielectric Composition Having Small Variation Of Capacitance With Temperature And Signal-matching Embedded Capacitor Prepared Using The Same App 20110034606 - PARK; Eun Tae ; et al.	2011-02-10
Printed circuit board with film capacitor embedded therein and method for manufacturing the same Grant 7,737,529 - Moon , et al. June 15, 2	2010-06-15
Thin film-capacitor-embedded printed circuit board and method of manufacturing the same Grant 7,675,756 - Moon , et al. March 9, 2	2010-03-09
Printed Circuit Board Material For Embedded Passive Devices And Preparing Method Thereof App 20090314419 - SOHN; Seung Hyun ; et al.	2009-12-24
PCB having electronic components embedded therein and method of manufacturing the same App 20090277673 - Sohn; Seung Hyun ; et al.	2009-11-12
Thin Film Capacitor-embedded Printed Circuit Board And Method Of Manufacturing The Same App 20090152121 - MOON; Jin Seok ; et al.	2009-06-18
Semiconductor memory package App 20090057860 - Bae; Seok ; et al.	2009-03-05
Capacitor and multi-layer board embedding the capacitor App 20080158777 - Sohn; Seung Hyun ; et al.	2008-07-03
Capacitor embedded printed circuit board and manufacturing method thereof App 20080100986 - Sohn; Seung Hyun ; et al.	2008-05-01
Method of fabricating printed circuit board having embedded multi-layer passive devices Grant 7,293,356 - Sohn , et al. November 13, 2	2007-11-13
Printed Circuit Board Material For Embedded Passive Devices And Preparing Method Thereof App 20070148421 - SOHN; Seung Hyun ; et al.	2007-06-28
Thin film capacitor-embedded printed circuit board and method of manufacturing the same App 20070102741 - Moon; Jin Seok ; et al.	2007-05-10
Method for manufacturing a printed circuit board with a film capacitor embedded therein, and a printed circuit board obtained thereby App 20070094871 - Moon; Jin Seok ; et al.	2007-05-03
Printed circuit board with film capacitor embedded therein and method for manufacturing the same App 20070085166 - Moon; Jin Seok ; et al.	2007-04-19
Composite dielectric composition having small variation of capacitance with temperature and signal-matching embedded capacitor prepared using the same App 20070087929 - Park; Eun Tae ; et al.	2007-04-19
Method of fabricating printed circuit board having embedded multi-layer passive devices App 20060203456 - Sohn; Seung Hyun ; et al.	2006-09-14
Resin composition for embedded capacitors having excellent adhesive strength, heat resistance and flame retardancy App 20060183872 - Lee; Seung Eun ; et al.	2006-08-17
Printed circuit board material for embedded passive devices App 20060062976 - Sohn; Seung Hyun ; et al.	2006-03-23

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.