loadpatents
name:-0.027122974395752
name:-0.0082321166992188
name:-0.0010180473327637
Sohn; Seung Hyun Patent Filings

Sohn; Seung Hyun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sohn; Seung Hyun.The latest application filed is for "apparatus and method for controlling adaptive reclosing based on transient stability".

Company Profile
0.6.24
  • Sohn; Seung Hyun - Suwon-si KR
  • Sohn; Seung Hyun - Suwon KR
  • Sohn; Seung Hyun - Kyungki-do KR
  • Sohn; Seung Hyun - Gyeonggi-do KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Apparatus and method for controlling adaptive reclosing based on transient stability
Grant 9,673,610 - Kim , et al. June 6, 2
2017-06-06
Apparatus And Method For Controlling Adaptive Reclosing Based On Transient Stability
App 20150263506 - KIM; Chul Hwan ;   et al.
2015-09-17
Piezoelectric device with piezoelectric polymer material
Grant 9,105,844 - Kim , et al. August 11, 2
2015-08-11
Piezoelectric Device Of Polymer
App 20130127299 - KIM; Woon Chun ;   et al.
2013-05-23
Conductive Subtrate And Method Of Manufacturing The Same
App 20130098668 - Kim; Woon Chun ;   et al.
2013-04-25
Printed Circuit Board Having Electro-component And Manufacturing Method Thereof
App 20120291274 - LEE; Jin-Won ;   et al.
2012-11-22
Method of manufacturing PCB having electronic components embedded therein
App 20120017435 - Sohn; Seung Hyun ;   et al.
2012-01-26
Electro Device Embedded Printed Circuit Board And Manufacturng Method Thereof
App 20110214913 - Lee; Jin-Won ;   et al.
2011-09-08
Electro Device Embedded Printed Circuit Board And Manufacturing Method Thereof
App 20110216515 - LEE; Jin-Won ;   et al.
2011-09-08
Electronic Component Embedded Printed Circuit Board And Method Of Manufacturing The Same
App 20110141711 - SOHN; Seung-Hyun ;   et al.
2011-06-16
Printed Circuit Board Having Electro-component And Manufacturing Method Thereof
App 20110116246 - LEE; Jin-Won ;   et al.
2011-05-19
Thin film capacitor-embedded printed circuit board and method of manufacturing the same
Grant 7,886,436 - Moon , et al. February 15, 2
2011-02-15
Composite Dielectric Composition Having Small Variation Of Capacitance With Temperature And Signal-matching Embedded Capacitor Prepared Using The Same
App 20110034606 - PARK; Eun Tae ;   et al.
2011-02-10
Printed circuit board with film capacitor embedded therein and method for manufacturing the same
Grant 7,737,529 - Moon , et al. June 15, 2
2010-06-15
Thin film-capacitor-embedded printed circuit board and method of manufacturing the same
Grant 7,675,756 - Moon , et al. March 9, 2
2010-03-09
Printed Circuit Board Material For Embedded Passive Devices And Preparing Method Thereof
App 20090314419 - SOHN; Seung Hyun ;   et al.
2009-12-24
PCB having electronic components embedded therein and method of manufacturing the same
App 20090277673 - Sohn; Seung Hyun ;   et al.
2009-11-12
Thin Film Capacitor-embedded Printed Circuit Board And Method Of Manufacturing The Same
App 20090152121 - MOON; Jin Seok ;   et al.
2009-06-18
Semiconductor memory package
App 20090057860 - Bae; Seok ;   et al.
2009-03-05
Capacitor and multi-layer board embedding the capacitor
App 20080158777 - Sohn; Seung Hyun ;   et al.
2008-07-03
Capacitor embedded printed circuit board and manufacturing method thereof
App 20080100986 - Sohn; Seung Hyun ;   et al.
2008-05-01
Method of fabricating printed circuit board having embedded multi-layer passive devices
Grant 7,293,356 - Sohn , et al. November 13, 2
2007-11-13
Printed Circuit Board Material For Embedded Passive Devices And Preparing Method Thereof
App 20070148421 - SOHN; Seung Hyun ;   et al.
2007-06-28
Thin film capacitor-embedded printed circuit board and method of manufacturing the same
App 20070102741 - Moon; Jin Seok ;   et al.
2007-05-10
Method for manufacturing a printed circuit board with a film capacitor embedded therein, and a printed circuit board obtained thereby
App 20070094871 - Moon; Jin Seok ;   et al.
2007-05-03
Printed circuit board with film capacitor embedded therein and method for manufacturing the same
App 20070085166 - Moon; Jin Seok ;   et al.
2007-04-19
Composite dielectric composition having small variation of capacitance with temperature and signal-matching embedded capacitor prepared using the same
App 20070087929 - Park; Eun Tae ;   et al.
2007-04-19
Method of fabricating printed circuit board having embedded multi-layer passive devices
App 20060203456 - Sohn; Seung Hyun ;   et al.
2006-09-14
Resin composition for embedded capacitors having excellent adhesive strength, heat resistance and flame retardancy
App 20060183872 - Lee; Seung Eun ;   et al.
2006-08-17
Printed circuit board material for embedded passive devices
App 20060062976 - Sohn; Seung Hyun ;   et al.
2006-03-23

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