Sohn; Ki Ju

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sohn; Ki Ju.The latest application filed is for "wafer to wafer bonding method and wafer to wafer bonding system".

Company Profile

10.5.7

Sohn; Ki Ju - Gunpo-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Imprinting apparatus Grant 10,946,577 - Yu , et al. March 16, 2	2021-03-16
Film frame, display substrate-manufacturing system, and display substrate-manufacturing method Grant 10,942,447 - Kim , et al. March 9, 2	2021-03-09
Wafer to wafer bonding method and wafer to wafer bonding system Grant 10,811,381 - Lee , et al. October 20, 2	2020-10-20
Ultraviolet curing apparatus Grant 10,647,107 - Yu , et al.	2020-05-12
Wafer To Wafer Bonding Method And Wafer To Wafer Bonding System App 20200043884 - LEE; JOON-HO ; et al.	2020-02-06
Vacuum Chuck For Bonding Substrates, Apparatus For Bonding Substrates Including The Same, And Method Of Bonding Substrates Using App 20200020562 - SOHN; Ki-Ju ; et al.	2020-01-16
Ultraviolet Curing Apparatus App 20190134974 - YU; Ho ; et al.	2019-05-09
Substrate Processing Apparatus App 20190131164 - KIM; Byeong Sang ; et al.	2019-05-02
Imprinting Apparatus App 20190099938 - YU; Ho ; et al.	2019-04-04
Imprint Apparatus And Method Of Manufacturing Display Panel App 20190086794 - YU; Ho ; et al.	2019-03-21
Film Frame, Display Substrate-manufacturing System, And Display Substrate-manufacturing Method App 20190049837 - KIM; Dong-wook ; et al.	2019-02-14
Suspension spring for shock absorber using carbon fiber reinforced plastic Grant 9,079,472 - Lee , et al. July 14, 2	2015-07-14

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