Sohn; Keungjin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sohn; Keungjin.The latest application filed is for "method of fabricating multilayered printed circuit board".

Company Profile

1.9.11

Sohn; Keungjin - Seongnam-si N/A KR
Sohn; Keungjin - Seoul N/A KR
Sohn; Keungjin - Suwon-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of manufacturing and insulating sheet Grant 8,997,340 - Sohn , et al. April 7, 2	2015-04-07
Method of fabricating semiconductor plastic package including a core board, build-up insulation layer, printed circuit, and semiconductor chip Grant 8,647,926 - Shin , et al. February 11, 2	2014-02-11
Method of manufacturing a printed circuit board Grant 8,499,441 - Park , et al. August 6, 2	2013-08-06
Method Of Fabricating Multilayered Printed Circuit Board App 20120174393 - IKEGUCHI; Nobuyuki ; et al.	2012-07-12
Method of manufacturing semiconductor package having a first board, second boards electrically connected to both sides of the first board, and at least one component connected to the first board by a flip chip method Grant 8,174,128 - Ikeguchi , et al. May 8, 2	2012-05-08
Method of manufacturing insulating sheet and printed circuit board having the same App 20120012247 - Sohn; Keungjin ; et al.	2012-01-19
Method of manufacturing semiconductor package and semiconductor plastic package using the same Grant 8,030,752 - Ikeguchi , et al. October 4, 2	2011-10-04
Printed circuit board and manufacturing method of the same App 20110139499 - Park; Jung-Hwan ; et al.	2011-06-16
Semiconductor plastic package and fabricating method thereof Grant 7,893,527 - Shin , et al. February 22, 2	2011-02-22
Method of fabricating semiconductor plastic package App 20100330747 - Shin; Joon-Sik ; et al.	2010-12-30
Method of manufacturing semiconductor package App 20100291737 - Ikeguchi; Nobuyuki ; et al.	2010-11-18
Insulating sheet and printed circuit board having the same App 20090242248 - Sohn; Keungjin ; et al.	2009-10-01
Method for manufacturing insulating sheet and method for manufacturing metal clad laminate and printed circuit board using the same App 20090236038 - Ikeguchi; Nobuyuki ; et al.	2009-09-24
Method of manufacturing semiconductor package and semiconductor plastic package using the same App 20090152742 - Ikeguchi; Nobuyuki ; et al.	2009-06-18
Printed circuit board and manufacturing method of the same App 20090084595 - Park; Jung-Hwan ; et al.	2009-04-02
Semiconductor plastic package and fabricating method thereof App 20090026604 - Shin; Joon-Sik ; et al.	2009-01-29
Multilayered printed circuit board and fabricating method thereof App 20090008136 - Ikeguchi; Nobuyuki ; et al.	2009-01-08

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