SOHN; Eun Sook

Patent Applications and Registrations

Patent applications and USPTO patent grants for SOHN; Eun Sook.The latest application filed is for "electronic package structure".

Company Profile

2.15.3

SOHN; Eun Sook - Seoul KR
Sohn; Eun Sook - Seongdong-gu N/A KR
Sohn; Eun Sook - Sungdong-gu KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic Package Structure App 20210265244 - HWANG; Tae Kyung ; et al.	2021-08-26
Electronic package structure with improved board level reliability Grant 11,011,455 - Hwang , et al. May 18, 2	2021-05-18
Semiconductor device and manufacturing method thereof Grant 10,483,222 - Paek , et al. Nov	2019-11-19
Electronic Package Structure App 20180166365 - HWANG; Tae Kyung ; et al.	2018-06-14
Chip-scale electronic package structure with conductive connective element having increased surface area and laterally spaced connection points for improved connectivity Grant 9,929,075 - Hwang , et al. March 27, 2	2018-03-27
Semiconductor device and manufacturing method thereof Grant 9,524,906 - Paek , et al. December 20, 2	2016-12-20
Electronic Package Structure App 20160260656 - Hwang; Tae Kyung ; et al.	2016-09-08
Semiconductor device and fabricating method thereof Grant 8,618,658 - Paek , et al. December 31, 2	2013-12-31
Semiconductor device capable of preventing dielectric layer from cracking Grant 8,492,893 - Sohn , et al. July 23, 2	2013-07-23
Package in package semiconductor device with film over wire Grant 8,487,420 - Hwang , et al. July 16, 2	2013-07-16
Semiconductor device and manufacturing method thereof Grant 8,362,612 - Paek , et al. January 29, 2	2013-01-29
Semiconductor device having improved contact interface reliability and method therefor Grant 8,193,624 - Sohn June 5, 2	2012-06-05
Reduced profile stackable semiconductor package Grant 8,026,589 - Kim , et al. September 27, 2	2011-09-27
Semiconductor package structure reducing warpage and manufacturing method thereof Grant 6,936,922 - Park , et al. August 30, 2	2005-08-30

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