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Patent applications and USPTO patent grants for SOGABE; Mari.The latest application filed is for "printed circuit board".
Patent | Date |
---|---|
Printed Circuit Board App 20220225500 - MOTOMURA; Junichi ;   et al. | 2022-07-14 |
Bonded diamond body, tool comprising the same, and method for manufacturing bonded diamond body Grant 10,603,720 - Higashi , et al. | 2020-03-31 |
Bonded Diamond Body, Tool Comprising The Same, And Method For Manufacturing Bonded Diamond Body App 20160221080 - Higashi; Taisuke ;   et al. | 2016-08-04 |
Magnesium Alloy Sheet And Magnesium Alloy Structural Member App 20150152527 - Inoue; Ryuichi ;   et al. | 2015-06-04 |
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