Soga; Kyoko

Patent Applications and Registrations

Patent applications and USPTO patent grants for Soga; Kyoko.The latest application filed is for "photosensitive resin composition, photosensitive dry film, layered product, and pattern formation method".

Company Profile

4.16.16

Soga; Kyoko - Annaka-shi JP
Soga; Kyoko - Annaka JP
Soga; Kyoko - Gunma-ken JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Photosensitive Resin Composition, Photosensitive Dry Film, Layered Product, And Pattern Formation Method App 20220236644 - Hayashi; Kumiko ; et al.	2022-07-28
Polysiloxane skeleton polymer, photosensitive resin composition, pattern forming process, and fabrication of opto-semiconductor device Grant 11,119,409 - Maruyama , et al. September 14, 2	2021-09-14
Laminate and pattern forming method Grant 10,948,823 - Asai , et al. March 16, 2	2021-03-16
Polysiloxane Skeleton Polymer, Photosensitive Resin Composition, Pattern Forming Process, And Fabrication Of Opto-semiconductor App 20200165456 - Maruyama; Hitoshi ; et al.	2020-05-28
Siloxane Polymer Containing Isocyanuric Acid And Polyether Skeletons, Photosensitive Resin Composition, Pattern Forming Process, App 20200165394 - Maruyama; Hitoshi ; et al.	2020-05-28
Method for manufacturing semiconductor apparatus, method for manufacturing flip-chip type semiconductor apparatus, semiconductor apparatus, and flip-chip type semiconductor apparatus Grant 10,416,557 - Soga , et al. Sept	2019-09-17
Film material and pattern forming process Grant 10,416,559 - Asai , et al. Sept	2019-09-17
Semiconductor apparatus, stacked semiconductor apparatus, encapsulated stacked-semiconductor apparatus, and method for manufacturing the same Grant 10,319,653 - Takemura , et al.	2019-06-11
Semiconductor apparatus, stacked semiconductor apparatus and encapsulated stacked-semiconductor apparatus each having photo-curable resin layer Grant 10,141,272 - Takemura , et al. Nov	2018-11-27
Photo-curable resin composition and photo-curable dry film using the same Grant 9,971,242 - Asai , et al. May 15, 2	2018-05-15
Film Material And Pattern Forming Process App 20180107115 - Asai; Satoshi ; et al.	2018-04-19
Laminate And Pattern Forming Method App 20180107116 - Asai; Satoshi ; et al.	2018-04-19
Silicone adhesive composition and solid-state imaging device Grant 9,796,892 - Yasuda , et al. October 24, 2	2017-10-24
Method For Manufacturing Semiconductor Apparatus, Method For Manufacturing Flip-chip Type Semiconductor Apparatus, Semiconductor Apparatus, And Flip-chip Type Semiconductor Apparatus App 20170250162 - SOGA; Kyoko ; et al.	2017-08-31
Semiconductor Apparatus, Stacked Semiconductor Apparatus, Encapsulated Stacked-semiconductor Apparatus, And Method For Manufacturing The Same App 20170103932 - TAKEMURA; Katsuya ; et al.	2017-04-13
Semiconductor apparatus, stacked semiconductor apparatus, encapsulated stacked-semiconductor apparatus, and method for manufacturing the same Grant 9,620,429 - Soga , et al. April 11, 2	2017-04-11
Semiconductor Apparatus, Stacked Semiconductor Apparatus, Encapsulated Stacked-semiconductor Apparatus, And Method For Manufacturing The Same App 20170077043 - TAKEMURA; Katsuya ; et al.	2017-03-16
Photo-curable Resin Composition And Photo-curable Dry Film Using The Same App 20160357105 - ASAI; Satoshi ; et al.	2016-12-08
Semiconductor Apparatus, Stacked Semiconductor Apparatus, Encapsulated Stacked-semiconductor Apparatus, And Method For Manufacturing The Same App 20160358833 - SOGA; Kyoko ; et al.	2016-12-08
Chemically amplified negative resist composition, photo-curable dry film, making method, patterning process, and electric/electronic part-protecting film Grant 9,494,863 - Asai , et al. November 15, 2	2016-11-15
Silicone Adhesive Composition And Solid-state Imaging Device App 20160289519 - YASUDA; Hiroyuki ; et al.	2016-10-06
Chemically Amplified Negative Resist Composition, Photo-curable Dry Film, Making Method, Patterning Process, And Electric/electronic Part-protecting Film App 20160097974 - Asai; Satoshi ; et al.	2016-04-07
Photo-curable resin composition, photo-curable dry film, patterning process, protective film, and electric/electronic part Grant 9,012,111 - Asai , et al. April 21, 2	2015-04-21
Adhesive composition and adhesive dry film Grant 8,889,810 - Takeda , et al. November 18, 2	2014-11-18
Photocurable resin composition, dry film thereof, pattern forming method, and electrical/electronic part protective film Grant 8,697,333 - Soga , et al. April 15, 2	2014-04-15
Photo-curable Resin Composition, Photo-curable Dry Film, Patterning Process, Protective Film, And Electric/electronic Part App 20130323631 - ASAI; Satoshi ; et al.	2013-12-05
Adhesive Composition And Adhesive Dry Film App 20120213993 - TAKEDA; Takanobu ; et al.	2012-08-23
Photocurable Resin Composition, Dry Film Thereof, Pattern Forming Method, And Electrical/electronic Part Protective Film App 20120094222 - SOGA; Kyoko ; et al.	2012-04-19
Positive photoresist composition Grant 6,773,858 - Kato , et al. August 10, 2	2004-08-10
Positive photoresist composition App 20040029032 - Kato, Hideto ; et al.	2004-02-12

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