Soerewyn; Herman V. D.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Soerewyn; Herman V. D..The latest application filed is for "molded package for semiconductor devices with leadframe locking structure".
- Soerewyn; Herman V. D. - Peabody MA
| Patent | Date |
|---|---|
| Molded package for semiconductor devices with leadframe locking structure Grant 5,225,897 - Reifel , et al. July 6, 1 | 1993-07-06 |
| Hermetically sealed, surface mountable component and carrier for semiconductor devices Grant 4,931,906 - Reifel , et al. June 5, 1 | 1990-06-05 |
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