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Patent applications and USPTO patent grants for SOEJIMA; Kazuki.The latest application filed is for "adhesive tape".
Patent | Date |
---|---|
Adhesive Tape App 20220298386 - NAKAO; Kota ;   et al. | 2022-09-22 |
Heat-resistant Pressure-sensitive Adhesive Tape For Production Of Semiconductor Device And Method For Producing Semiconductor Device Using The Tape App 20130240141 - SOEJIMA; Kazuki ;   et al. | 2013-09-19 |
Heat-peelable pressure-sensitive adhesive sheet for cutting laminated ceramic sheet and method for cut-processing laminated ceramic sheet Grant 8,524,361 - Soejima , et al. September 3, 2 | 2013-09-03 |
Pressure-sensitive Adhesive Tape For Temporary Fixing Of Electronic Part App 20120237764 - SOEJIMA; Kazuki ;   et al. | 2012-09-20 |
Heat-peelable Pressure-sensitive Adhesive Sheet For Cutting Laminated Ceramic Sheet And Method For Cut-processing Laminated Ceramic Sheet App 20100224316 - SOEJIMA; Kazuki ;   et al. | 2010-09-09 |
Manufacturing method of front core for magnetic erase head and front core for magnetic erase head produced thereby App 20040075941 - Soejima, Kazuki | 2004-04-22 |
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