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Patent applications and USPTO patent grants for Soderstrom; Ronald L..The latest application filed is for "high-density packaging for multiple removable electronics subassemblies".
Patent | Date |
---|---|
High-density packaging for multiple removable electronics subassemblies Grant 5,329,428 - Block , et al. July 12, 1 | 1994-07-12 |
Optical fiber link control safety system Grant 5,136,410 - Heiling , et al. August 4, 1 | 1992-08-04 |
Optical fiber link card Grant 5,069,522 - Block , et al. December 3, 1 | 1991-12-03 |
Optical fiber link card Grant 5,039,194 - Block , et al. August 13, 1 | 1991-08-13 |
Precision measurement and positioning system for disk storage system Grant 4,870,635 - Block , et al. September 26, 1 | 1989-09-26 |
Serial optical interconnect bus for logic cards and the like Grant 4,850,044 - Block , et al. July 18, 1 | 1989-07-18 |
Phase retardation element and prism for use in an optical data storage system Grant 4,595,261 - Baasch , et al. June 17, 1 | 1986-06-17 |
Thermal print head having glazed metal substrate Grant 4,423,425 - Reese , et al. December 27, 1 | 1983-12-27 |
Compensating driver circuit for thermal print head Grant 4,305,080 - Cunningham , et al. December 8, 1 | 1981-12-08 |
Omnidirectional optical scanner Grant 3,919,527 - Bowen , et al. November 11, 1 | 1975-11-11 |
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