Soda; Eiichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Soda; Eiichi.The latest application filed is for "method of separating bonded substrate, method of manufacturing semiconductor storage device, and substrate separation apparatus".

Company Profile

1.13.18

Soda; Eiichi - Nagoya JP
Soda; Eiichi - Mie JP
Soda; Eiichi - Miegunkomono JP
Soda; Eiichi - Kawasaki N/A JP
SODA; Eiichi - Kanagawa JP
Soda; Eiichi - Ibaraki JP
Soda; Eiichi - Tsukuba JP
Soda, Eiichi - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of separating bonded substrate, method of manufacturing semiconductor storage device, and substrate separation apparatus Grant 11,152,329 - Soda October 19, 2	2021-10-19
Method Of Separating Bonded Substrate, Method Of Manufacturing Semiconductor Storage Device, And Substrate Separation Apparatus App 20200294963 - Soda; Eiichi	2020-09-17
Manufacturing method of semiconductor device and template for nanoimprint Grant 10,153,176 - Soda Dec	2018-12-11
Substrate planarizing method and dropping amount calculating method Grant 9,941,137 - Takahata , et al. April 10, 2	2018-04-10
Manufacturing Method Of Semiconductor Device And Template For Nanoimprint App 20170263445 - SODA; Eiichi	2017-09-14
Substrate Planarizing Method And Dropping Amount Calculating Method App 20160351409 - Takahata; Kazuhiro ; et al.	2016-12-01
Pattern Formation Method App 20160313644 - OORI; Tomoya ; et al.	2016-10-27
Nonvolatile semiconductor memory device and method of manufacturing nonvolatile semiconductor memory device Grant 9,391,086 - Soda , et al. July 12, 2	2016-07-12
Method of making a semiconductor device Grant 8,586,478 - Soda , et al. November 19, 2	2013-11-19
Method Of Making A Semiconductor Device App 20120329268 - SODA; Eiichi ; et al.	2012-12-27
Method for manufacturing semiconductor device, and method for processing etching-target film Grant 8,124,322 - Soda February 28, 2	2012-02-28
Method for manufacturing a semiconductor device Grant 7,799,693 - Soda September 21, 2	2010-09-21
Method of patterning multiple-layered resist film and method of manufacturing semiconductor device Grant 7,754,543 - Soda July 13, 2	2010-07-13
Method for manufacturing electronic device Grant 7,541,281 - Soda , et al. June 2, 2	2009-06-02
Method For Manufacturing Semiconductor Device, And Method For Processing Etching-target Film App 20090123875 - SODA; Eiichi	2009-05-14
Method of fabricating semiconductor device Grant 7,488,691 - Soda February 10, 2	2009-02-10
Method for manufacturing electronic device Grant 7,439,171 - Soda , et al. October 21, 2	2008-10-21
Method of fabricating semiconductor device App 20080020562 - Soda; Eiichi	2008-01-24
Method of patterning multiple-layered resist film and method of manufacturing semiconductor device App 20070141764 - Soda; Eiichi	2007-06-21
Method for manufacturing semiconductor device Grant 7,229,915 - Soda June 12, 2	2007-06-12
Method for manufacturing electronic device App 20060094219 - Soda; Eiichi	2006-05-04
Method for manufacturing electonic device App 20060094234 - Soda; Eiichi ; et al.	2006-05-04
Method for manufacturing electronic device App 20060094221 - Soda; Eiichi ; et al.	2006-05-04
Method for manufacturing a semiconductor device App 20060019491 - Soda; Eiichi	2006-01-26
Method for manufacturing semiconductor device App 20050191850 - Soda, Eiichi	2005-09-01
Method for manufacturing semiconductor device App 20050153536 - Soda, Eiichi	2005-07-14
Method for manufacturing semiconductor device App 20030190807 - Soda, Eiichi ; et al.	2003-10-09
Method for manufacturing semiconductor device including two-step ashing process of N2 plasma gas and N2/H2 plasma gas App 20030054656 - Soda, Eiichi	2003-03-20
Semiconductor device manufacturing method App 20020119677 - Soda, Eiichi ; et al.	2002-08-29
Method of manufacturing semiconductor device App 20010036728 - Shinmura, Toshiki ; et al.	2001-11-01

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