loadpatents
name:-0.022243022918701
name:-0.017217874526978
name:-0.0040409564971924
Snyder; Tanya Jegeris Patent Filings

Snyder; Tanya Jegeris

Patent Applications and Registrations

Patent applications and USPTO patent grants for Snyder; Tanya Jegeris.The latest application filed is for "ink jet printer production techniques".

Company Profile
4.16.18
  • Snyder; Tanya Jegeris - Edina MN
  • Snyder; Tanya Jegeris - Edna MN
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method for ink jet durability and adhesion
Grant 11,446,946 - Lien , et al. September 20, 2
2022-09-20
Ink Jet Printer Production Techniques
App 20220184973 - Lien; Brent D. ;   et al.
2022-06-16
Inkjet Printer Image Improvement Techniques
App 20220080740 - Snyder; Tanya Jegeris ;   et al.
2022-03-17
Method For Ink Jet Durability And Adhesion
App 20220080762 - Lien; Brent D. ;   et al.
2022-03-17
Ink Jet Nozzle Health And Printing Reliability
App 20220080722 - Lien; Brent D. ;   et al.
2022-03-17
Ink Jet Printer Production Techniques
App 20220080745 - Lien; Brent D. ;   et al.
2022-03-17
Ink Jet Printer Overspray Techniques
App 20220080724 - Skoglund; John P. ;   et al.
2022-03-17
Card printer alignment bracket
Grant 11,027,565 - Woizeschke , et al. June 8, 2
2021-06-08
Card Printer Alignment Bracket
App 20210101394 - Woizeschke; Michael Jon ;   et al.
2021-04-08
Sensor for identifying registration marks on a ribbon
Grant 10,434,792 - Stangler , et al. O
2019-10-08
Used transfer layer detection in a transfer printing device
Grant 10,434,791 - Stangler , et al. O
2019-10-08
Sensor For Identifying Registration Marks On A Ribbon
App 20180186154 - Stangler; Jeffrey Lee ;   et al.
2018-07-05
Sensor for identifying registration marks on a ribbon
Grant 9,962,952 - Stangler , et al. May 8, 2
2018-05-08
Used Transfer Layer Detection In A Transfer Printing Device
App 20170259583 - Stangler; Jeffrey L. ;   et al.
2017-09-14
Sensor For Identifying Registration Marks On A Ribbon
App 20170087870 - Stangler; Jeffrey Lee ;   et al.
2017-03-30
Used transfer layer detection in a transfer printing device
Grant 9,561,668 - Stangler , et al. February 7, 2
2017-02-07
Capping method for laser diode protection
Grant 8,982,923 - Cole , et al. March 17, 2
2015-03-17
Capping Method For Laser Diode Protection
App 20150036467 - Cole; Douglas ;   et al.
2015-02-05
Capping method for laser diode protection
Grant 8,532,157 - Cole , et al. September 10, 2
2013-09-10
Transducer bonded to a laser module for heat assisted magnetic recording
Grant 8,488,435 - Snyder July 16, 2
2013-07-16
Transducer Bonded To A Laser Module For Heat Assisted Magnetic Recording
App 20120327752 - Snyder; Tanya Jegeris
2012-12-27
Integrated heat assisted magnetic recording device
Grant 8,254,212 - Snyder , et al. August 28, 2
2012-08-28
Capping Method For Laser Diode Protection
App 20120044967 - Cole; Douglas ;   et al.
2012-02-23
Integrated Heat Assisted Magnetic Recording Device
App 20100328807 - Snyder; Tanya Jegeris ;   et al.
2010-12-30
Wafer-level packaging of optoelectronic devices
Grant 7,422,929 - Gallup , et al. September 9, 2
2008-09-09
Wafer bonding using reactive foils for massively parallel micro-electromechanical systems packaging
Grant 7,202,553 - Snyder , et al. April 10, 2
2007-04-10
Wafer bonding using reactive foils for massively parallel micro-electromechanical systems packaging
Grant 7,176,106 - Snyder , et al. February 13, 2
2007-02-13
Wafer-level packaging of optoelectronic devices
Grant 6,953,990 - Gallup , et al. October 11, 2
2005-10-11
Wafer-level packaging of optoelectronic devices
App 20050142692 - Gallup, Kendra J. ;   et al.
2005-06-30
Wafer-level packaging of optoelectronic devices
App 20050062122 - Gallup, Kendra J. ;   et al.
2005-03-24
Wafer bonding using reactive foils for massively parallel micro-electromechanical systems packaging
App 20040251524 - Snyder, Tanya Jegeris ;   et al.
2004-12-16
Wafer bonding using reactive foils for massively parallel micro-electromechanical systems packaging
App 20040253765 - Snyder, Tanya Jegeris ;   et al.
2004-12-16

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