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Patent applications and USPTO patent grants for Snyder; Tanya Jegeris.The latest application filed is for "ink jet printer production techniques".
Patent | Date |
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Method for ink jet durability and adhesion Grant 11,446,946 - Lien , et al. September 20, 2 | 2022-09-20 |
Ink Jet Printer Production Techniques App 20220184973 - Lien; Brent D. ;   et al. | 2022-06-16 |
Inkjet Printer Image Improvement Techniques App 20220080740 - Snyder; Tanya Jegeris ;   et al. | 2022-03-17 |
Method For Ink Jet Durability And Adhesion App 20220080762 - Lien; Brent D. ;   et al. | 2022-03-17 |
Ink Jet Nozzle Health And Printing Reliability App 20220080722 - Lien; Brent D. ;   et al. | 2022-03-17 |
Ink Jet Printer Production Techniques App 20220080745 - Lien; Brent D. ;   et al. | 2022-03-17 |
Ink Jet Printer Overspray Techniques App 20220080724 - Skoglund; John P. ;   et al. | 2022-03-17 |
Card printer alignment bracket Grant 11,027,565 - Woizeschke , et al. June 8, 2 | 2021-06-08 |
Card Printer Alignment Bracket App 20210101394 - Woizeschke; Michael Jon ;   et al. | 2021-04-08 |
Sensor for identifying registration marks on a ribbon Grant 10,434,792 - Stangler , et al. O | 2019-10-08 |
Used transfer layer detection in a transfer printing device Grant 10,434,791 - Stangler , et al. O | 2019-10-08 |
Sensor For Identifying Registration Marks On A Ribbon App 20180186154 - Stangler; Jeffrey Lee ;   et al. | 2018-07-05 |
Sensor for identifying registration marks on a ribbon Grant 9,962,952 - Stangler , et al. May 8, 2 | 2018-05-08 |
Used Transfer Layer Detection In A Transfer Printing Device App 20170259583 - Stangler; Jeffrey L. ;   et al. | 2017-09-14 |
Sensor For Identifying Registration Marks On A Ribbon App 20170087870 - Stangler; Jeffrey Lee ;   et al. | 2017-03-30 |
Used transfer layer detection in a transfer printing device Grant 9,561,668 - Stangler , et al. February 7, 2 | 2017-02-07 |
Capping method for laser diode protection Grant 8,982,923 - Cole , et al. March 17, 2 | 2015-03-17 |
Capping Method For Laser Diode Protection App 20150036467 - Cole; Douglas ;   et al. | 2015-02-05 |
Capping method for laser diode protection Grant 8,532,157 - Cole , et al. September 10, 2 | 2013-09-10 |
Transducer bonded to a laser module for heat assisted magnetic recording Grant 8,488,435 - Snyder July 16, 2 | 2013-07-16 |
Transducer Bonded To A Laser Module For Heat Assisted Magnetic Recording App 20120327752 - Snyder; Tanya Jegeris | 2012-12-27 |
Integrated heat assisted magnetic recording device Grant 8,254,212 - Snyder , et al. August 28, 2 | 2012-08-28 |
Capping Method For Laser Diode Protection App 20120044967 - Cole; Douglas ;   et al. | 2012-02-23 |
Integrated Heat Assisted Magnetic Recording Device App 20100328807 - Snyder; Tanya Jegeris ;   et al. | 2010-12-30 |
Wafer-level packaging of optoelectronic devices Grant 7,422,929 - Gallup , et al. September 9, 2 | 2008-09-09 |
Wafer bonding using reactive foils for massively parallel micro-electromechanical systems packaging Grant 7,202,553 - Snyder , et al. April 10, 2 | 2007-04-10 |
Wafer bonding using reactive foils for massively parallel micro-electromechanical systems packaging Grant 7,176,106 - Snyder , et al. February 13, 2 | 2007-02-13 |
Wafer-level packaging of optoelectronic devices Grant 6,953,990 - Gallup , et al. October 11, 2 | 2005-10-11 |
Wafer-level packaging of optoelectronic devices App 20050142692 - Gallup, Kendra J. ;   et al. | 2005-06-30 |
Wafer-level packaging of optoelectronic devices App 20050062122 - Gallup, Kendra J. ;   et al. | 2005-03-24 |
Wafer bonding using reactive foils for massively parallel micro-electromechanical systems packaging App 20040251524 - Snyder, Tanya Jegeris ;   et al. | 2004-12-16 |
Wafer bonding using reactive foils for massively parallel micro-electromechanical systems packaging App 20040253765 - Snyder, Tanya Jegeris ;   et al. | 2004-12-16 |
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