Snider; Richard P.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Snider; Richard P..The latest application filed is for "flexible coolant manifold - heat sink assembly".

Company Profile

0.8.8

Snider; Richard P. - New Paltz NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Flexible coolant manifold--heat sink assembly Grant 9,913,403 - Krug, Jr. , et al. March 6, 2	2018-03-06
Interlock assembly for air-moving assembly Grant 9,648,786 - Campbell , et al. May 9, 2	2017-05-09
Interlock assembly for air-moving assembly Grant 9,629,284 - Campbell , et al. April 18, 2	2017-04-18
Flexible coolant manifold-heat sink assembly Grant 9,504,184 - Krug, Jr. , et al. November 22, 2	2016-11-22
Thermal transfer structure(s) and attachment mechanism(s) facilitating cooling of electronics card(s) Grant 9,497,888 - Arvelo , et al. November 15, 2	2016-11-15
Flexible Coolant Manifold - Heat Sink Assembly App 20160295741 - KRUG; Francis R. ; et al.	2016-10-06
Flexible Coolant Manifold - Heat Sink Assembly App 20160242318 - KRUG, JR.; Francis R. ; et al.	2016-08-18
Interlock Assembly For Air-moving Assembly App 20160095263 - CAMPBELL; Levi A. ; et al.	2016-03-31
Interlock Assembly For Air-moving Assembly App 20160095261 - CAMPBELL; Levi A. ; et al.	2016-03-31
Methods of fabricating a coolant-cooled electronic assembly Grant 9,298,231 - Arvelo , et al. March 29, 2	2016-03-29
Thermal transfer and coolant-cooled structures facilitating cooling of electronics card(s) Grant 9,265,178 - Arvelo , et al. February 16, 2	2016-02-16
Fabricating thermal transfer and coolant-cooled structures for cooling electronics card(s) Grant 9,253,923 - Arvelo , et al. February 2, 2	2016-02-02
Fabricating Thermal Transfer And Coolant-cooled Structures For Cooling Electronics Card(s) App 20150052754 - ARVELO; Amilcar R. ; et al.	2015-02-26
Fabricating Thermal Transfer Structure(s) And Attachment Mechanism(s) For Cooling Electronics Card(s) App 20150047809 - ARVELO; Amilcar R. ; et al.	2015-02-19
Thermal Transfer Structure(s) And Attachment Mechanism(s) Facilitating Cooling Of Electronics Card(s) App 20140238640 - ARVELO; Amilcar R. ; et al.	2014-08-28
Thermal Transfer And Coolant-cooled Structures Facilitating Cooling Of Electronics Card(s) App 20140240930 - ARVELO; Amilcar R. ; et al.	2014-08-28

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.