Smythe; Robert Michael

Patent Applications and Registrations

Patent applications and USPTO patent grants for Smythe; Robert Michael.The latest application filed is for "compliant multilayered thermally-conductive interface assemblies".

Company Profile

0.8.11

Smythe; Robert Michael - Ewing NJ
Smythe; Robert Michael - Cleveland OH

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Circuit assemblies including thermoelectric modules Grant 9,322,580 - Hershberger , et al. April 26, 2	2016-04-26
Compliant multilayered thermally-conductive interface assemblies Grant 9,222,735 - Hill , et al. December 29, 2	2015-12-29
Compliant Multilayered Thermally-conductive Interface Assemblies App 20140374080 - Hill; Richard F. ; et al.	2014-12-25
Memory modules including compliant multilayered thermally-conductive interface assemblies Grant 8,837,151 - Hill , et al. September 16, 2	2014-09-16
Circuit Assemblies Including Thermoelectric Modules App 20140150839 - Hershberger; Jeffrey Gerard ; et al.	2014-06-05
Circuit assemblies including thermoelectric modules Grant 8,649,179 - Hershberger , et al. February 11, 2	2014-02-11
Circuit Assemblies Including Thermoelectric Modules App 20120201008 - Hershberger; Jeffrey Gerard ; et al.	2012-08-09
Thermoelectric Modules, Thermoelectric Assemblies, and Related Methods App 20120174956 - Smythe; Robert Michael ; et al.	2012-07-12
Thermoelectric modules and related methods Grant 8,193,439 - Smythe , et al. June 5, 2	2012-06-05
Memory Modules Including Compliant Multilayered Thermally-Conductive Interface Assemblies App 20120087094 - Hill; Richard F. ; et al.	2012-04-12
Compliant Multilayered Thermally-conductive Interface Assemblies Having Emi Shielding Properties App 20120061135 - Hill; Richard F. ; et al.	2012-03-15
Memory modules including compliant multilayered thermally-conductive interface assemblies Grant 8,081,468 - Hill , et al. December 20, 2	2011-12-20
Thermoelectric Modules And Related Methods App 20110030754 - Smythe; Robert Michael ; et al.	2011-02-10
Flexible Assemblies With Integrated Thermoelectric Modules Suitable For Use In Extracting Power From Or Dissipating Heat From Fluid Conduits App 20110000516 - Hershberger; Jeffrey Gerard ; et al.	2011-01-06
Thermoelectric Modules And Related Methods App 20100319744 - Smythe; Robert Michael ; et al.	2010-12-23
Compliant Multilayered Thermally-conductive Interface Assemblies App 20100321897 - Hill; Richard F. ; et al.	2010-12-23
Memory Modules Including Compliant Multilayered Thermally-conductive Interface Assemblies App 20100321895 - Hill; Richard F. ; et al.	2010-12-23

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