Smith; Sean P. E.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Smith; Sean P. E..The latest application filed is for "manufacturable cowp metal cap process for copper interconnects".

Company Profile

0.6.6

Smith; Sean P. E. - Hopewell Junction NY
Smith; Sean P. E. - Putnam Valley NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Manufacturable CoWP metal cap process for copper interconnects Grant 7,407,605 - Restaino , et al. August 5, 2	2008-08-05
MANUFACTURABLE CoWP METAL CAP PROCESS FOR COPPER INTERCONNECTS App 20070215842 - Restaino; Darryl D. ; et al.	2007-09-20
Manufacturable CoWP metal cap process for copper interconnects Grant 7,253,106 - Restaino , et al. August 7, 2	2007-08-07
MANUFACTURABLE CoWP METAL CAP PROCESS FOR COPPER INTERCONNECTS App 20060134911 - Restaino; Darryl D. ; et al.	2006-06-22
Copper recess process with application to selective capping and electroless plating Grant 7,064,064 - Chen , et al. June 20, 2	2006-06-20
Very low effective dielectric constant interconnect structures and methods for fabricating the same Grant 7,045,453 - Canaperi , et al. May 16, 2	2006-05-16
Very low effective dielectric constant interconnect Structures and methods for fabricating the same Grant 7,023,093 - Canaperi , et al. April 4, 2	2006-04-04
Copper recess process with application to selective capping and electroless plating Grant 6,975,032 - Chen , et al. December 13, 2	2005-12-13
Very low effective dielectric constant interconnect structures and methods for fabricating the same App 20050186778 - Canaperi, Donald F. ; et al.	2005-08-25
Copper recess process with application to selective capping and electroless plating App 20050158985 - Chen, Shyng-Tsong ; et al.	2005-07-21
Copper recess process with application to selective capping and electroless plating App 20040113279 - Chen, Shyng-Tsong ; et al.	2004-06-17
Very low effective dielectric constant interconnect Structures and methods for fabricating the same App 20040087135 - Canaperi, Donald F. ; et al.	2004-05-06

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