Smith; Lee J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Smith; Lee J..The latest application filed is for "semiconductor package having leadframe with exposed anchor pads".

Company Profile

0.8.2

Smith; Lee J. - Chandler AZ
Smith; Lee J. - Tucson AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
High density memory card using folded flex Grant 9,367,712 - Smith , et al. June 14, 2	2016-06-14
Shielding for a semiconductor package Grant 8,129,824 - St. Amand , et al. March 6, 2	2012-03-06
Semiconductor package having leadframe with exposed anchor pads Grant 8,089,141 - Smith January 3, 2	2012-01-03
Semiconductor package having leadframe with exposed anchor pads Grant 7,687,893 - Smith March 30, 2	2010-03-30
Semiconductor Package Having Leadframe with Exposed Anchor Pads App 20080157311 - Smith; Lee J.	2008-07-03
Method of making a semiconductor package including stacked semiconductor dies Grant 6,650,019 - Glenn , et al. November 18, 2	2003-11-18
Method of making a semiconductor package including stacked semiconductor dies App 20020195624 - Glenn, Thomas P. ; et al.	2002-12-26
Semiconductor package including stacked semiconductor dies and bond wires Grant 6,472,758 - Glenn , et al. October 29, 2	2002-10-29
Slope monitoring device Grant 5,216,922 - Gustafson , et al. June 8, 1	1993-06-08

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