Smith; James Denning
Patent Applications and Registrations
Patent applications and USPTO patent grants for Smith; James Denning.The latest application filed is for "packaged mems device assembly".
- Smith; James Denning - Corvallis OR
- Smith; James Denning - Albany OR
| Patent | Date |
|---|---|
| Packaged MEMS device assembly Grant 7,723,811 - Haluzak , et al. May 25, 2 | 2010-05-25 |
| Packaged MEMS device assembly App 20080272446 - Haluzak; Charles C. ; et al. | 2008-11-06 |
| Emitter with dielectric layer having implanted conducting centers Grant 7,170,223 - Smith , et al. January 30, 2 | 2007-01-30 |
| Emitter with dielectric layer having implanted conducting centers App 20040012338 - Smith, James Denning ; et al. | 2004-01-22 |
| Method of abrading silicon substrate Grant 6,623,338 - Pettit , et al. September 23, 2 | 2003-09-23 |
| Method of forming ink fill slot of ink-jet printhead Grant 6,623,335 - Pettit , et al. September 23, 2 | 2003-09-23 |
| Pressurized delivery method for abrasive particulate material App 20020052175 - Pettit, Thomas E. ; et al. | 2002-05-02 |
| Method of abrading silicon substrate App 20020049025 - Pettit, Thomas E. ; et al. | 2002-04-25 |
| Method of forming ink fill slot of ink-jet printhead App 20020045405 - Pettit, Thomas E. ; et al. | 2002-04-18 |
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