Smith, III; Edward F.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Smith, III; Edward F..The latest application filed is for "hermetic electrical feedthrough comprising a pt-ni-based pin alloy".
- Smith, III; Edward F. - Madison CT
- Smith, III; Edward F. - Las Flores CA
| Patent | Date |
|---|---|
| Hermetic Electrical Feedthrough Comprising a Pt-Ni-based Pin Alloy App 20210327614 - Susan; Donald F. ; et al. | 2021-10-21 |
| Palladium-based alloys Grant 11,041,228 - Klein , et al. June 22, 2 | 2021-06-22 |
| Palladium-Based Alloys App 20190330713 - Klein; Arthur S. ; et al. | 2019-10-31 |
| Palladium-based alloys Grant 10,385,424 - Klein , et al. A | 2019-08-20 |
| Palladium-Based Alloys App 20170218481 - Klein; Arthur S. ; et al. | 2017-08-03 |
| Palladium-based alloys for use in the body and suitable for MRI imaging Grant 9,234,262 - Klein , et al. January 12, 2 | 2016-01-12 |
| Apparatuses And Methods For Fuel Level Sensing App 20150300869 - Klein; Arthur S. ; et al. | 2015-10-22 |
| Gold-based alloy, free of silver and tin, for dental copings or abutments Grant 8,845,959 - Hale , et al. September 30, 2 | 2014-09-30 |
| Visual indicator of proper interconnection for an implanted medical device Grant 8,206,175 - Boyd , et al. June 26, 2 | 2012-06-26 |
| Electrical connection apparatus Grant 8,187,015 - Boyd , et al. May 29, 2 | 2012-05-29 |
| Gold-based Alloy, Free Of Silver And Tin, For Dental Copings Or Abutments App 20120039744 - Hale; Peter ; et al. | 2012-02-16 |
| Electrical Connection Apparatus App 20110151698 - Boyd; Garth W. ; et al. | 2011-06-23 |
| Electrical barrier and moisture seal for an implanted medical device Grant 7,942,686 - Boyd , et al. May 17, 2 | 2011-05-17 |
| Visual Indicator Of Proper Interconnection For An Implanted Medical Device App 20110039445 - Boyd; Garth W. ; et al. | 2011-02-17 |
| Electrical Barrier And Moisture Seal For An Implanted Medical Device App 20100261362 - Boyd; Garth W. ; et al. | 2010-10-14 |
| Stackable electrical connection apparatus Grant 7,690,953 - Boyd , et al. April 6, 2 | 2010-04-06 |
| Palladium-based Alloys For Use In The Body And Suitable For Mri Imaging App 20090191087 - Klein; Arthur S. ; et al. | 2009-07-30 |
| Palladium Alloy App 20080279717 - Klein; Arthur S. ; et al. | 2008-11-13 |
| Palladium alloy Grant 7,354,488 - Klein , et al. April 8, 2 | 2008-04-08 |
| Manifold device for manipulation of radioactive fluid Grant 6,450,936 - Smith, III , et al. September 17, 2 | 2002-09-17 |
| High strength silver palladium alloy Grant 5,833,774 - Klein , et al. November 10, 1 | 1998-11-10 |
| Silver palladium alloy Grant 5,484,569 - Klein , et al. January 16, 1 | 1996-01-16 |
| Dental alloy and restoration made therewith Grant 5,290,371 - Cameron , et al. March 1, 1 | 1994-03-01 |
| Sealing glass composite Grant 4,818,730 - Smith, III , et al. April 4, 1 | 1989-04-04 |
| Metal electronic package sealed with thermoplastic having a grafted metal deactivator and antioxidant Grant 4,812,896 - Rothgery , et al. March 14, 1 | 1989-03-14 |
| Hermetically sealed semiconductor package Grant 4,805,009 - Pryor , et al. February 14, 1 | 1989-02-14 |
| Sealing glass composite Grant 4,752,521 - Smith, III , et al. June 21, 1 | 1988-06-21 |
| One-step plasma treatment of copper foils to increase their laminate adhesion Grant 4,598,022 - Haque , et al. July 1, 1 | 1986-07-01 |
| Adhesion primers for encapsulating epoxies Grant 4,582,556 - Butt , et al. April 15, 1 | 1986-04-15 |
| Adhesion primers for encapsulating epoxies Grant 4,525,422 - Butt , et al. June 25, 1 | 1985-06-25 |
| Three-step plasma treatment of copper foils to enhance their laminate adhesion Grant 4,524,089 - Haque , et al. June 18, 1 | 1985-06-18 |
| Casing for electronic components Grant 4,521,469 - Butt , et al. June 4, 1 | 1985-06-04 |
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