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Patent applications and USPTO patent grants for Smith; Grant M..The latest application filed is for "modular packaging configuration and system and method of use for a computer system adapted for operating multiple operating systems in different partitions".
Patent | Date |
---|---|
Fan tray assembly Grant 7,054,155 - Mease , et al. May 30, 2 | 2006-05-30 |
Method and apparatus for EMI shielding Grant 6,992,894 - Mease , et al. January 31, 2 | 2006-01-31 |
Computer system and method configured for improved cooling Grant 6,987,667 - Mease , et al. January 17, 2 | 2006-01-17 |
Modular packaging configuration and system and method of use for a computer system adapted for operating multiple operating systems in different partitions Grant 6,970,348 - Treiber , et al. November 29, 2 | 2005-11-29 |
Apparatus and method for shielding a circuit board Grant 6,862,181 - Smith , et al. March 1, 2 | 2005-03-01 |
Forced convection heat sink system with fluid vector control Grant 6,847,525 - Smith , et al. January 25, 2 | 2005-01-25 |
Retention of heat sinks on electronic packages Grant 6,788,538 - Gibbs , et al. September 7, 2 | 2004-09-07 |
Apparatus and method for shielding electromagnetic radiation Grant 6,664,463 - Treiber , et al. December 16, 2 | 2003-12-16 |
Modular packaging configuration and system and method of use for a computer system adapted for operating multiple operating systems in different partitions App 20030011976 - Treiber, Mark R. ;   et al. | 2003-01-16 |
Air mover system with reduced reverse air flow Grant 6,217,440 - Wessel , et al. April 17, 2 | 2001-04-17 |
Parallel cooling of high power devices in a serially cooled evironment Grant 6,198,628 - Smith March 6, 2 | 2001-03-06 |
Stackable high density RAM modules Grant 6,049,467 - Tamarkin , et al. April 11, 2 | 2000-04-11 |
Stacked circuit board assembly adapted for heat dissipation Grant 5,986,887 - Smith , et al. November 16, 1 | 1999-11-16 |
Passively cooled display door Grant 5,717,572 - Smith , et al. February 10, 1 | 1998-02-10 |
Parallel-flow air system for cooling electronic equipment Grant 4,674,004 - Smith , et al. June 16, 1 | 1987-06-16 |
Contact probe assembly Grant 4,647,852 - Smith , et al. March 3, 1 | 1987-03-03 |
Wire form heat exchange element Grant 4,465,130 - Romania , et al. August 14, 1 | 1984-08-14 |
Heat exchanger for integrated circuit packages Grant 4,421,161 - Romania , et al. December 20, 1 | 1983-12-20 |
Videotape cue control and display apparatus Grant 4,386,379 - Smith , et al. May 31, 1 | 1983-05-31 |
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