Smith; Darrick T.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Smith; Darrick T..The latest application filed is for "high density slider clamp fixture".

Company Profile

7.12.11

Smith; Darrick T. - San Jose CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of making a high density slider clamp fixture Grant 11,307,028 - Smith , et al. April 19, 2	2022-04-19
Within-row stripe height and wedge angle control for magnetic recording read-write heads Grant 10,850,364 - Smith , et al. December 1, 2	2020-12-01
High Density Slider Clamp Fixture App 20200278199 - Smith; Darrick T. ; et al.	2020-09-03
Actuator tilt interposer for within-row lapping mount tool for magnetic recording read-write heads Grant 10,702,969 - Smith , et al.	2020-07-07
High density slider clamp fixture Grant 10,655,959 - Smith , et al.	2020-05-19
High Density Slider Clamp Fixture App 20190195625 - Smith; Darrick T. ; et al.	2019-06-27
Actuator Tilt Interposer For Within-Row Lapping Mount Tool For Magnetic Recording Read-Write Heads App 20180185978 - Smith; Darrick T. ; et al.	2018-07-05
Within-Row Stripe Height And Wedge Angle Control For Magnetic Recording Read-Write Heads App 20180185977 - Smith; Darrick T. ; et al.	2018-07-05
Within-row wedge angle control for magnetic recording read-write heads Grant 9,881,639 - Davis , et al. January 30, 2	2018-01-30
Within-Row Wedge Angle Control For Magnetic Recording Read-Write Heads App 20170372729 - Davis; Damaris ; et al.	2017-12-28
Apparatuses, Systems, And Methods For Processing Semiconductor Components App 20170349381 - Beaucage; Jacey R. ; et al.	2017-12-07
Wire bonding electrical lapping guides for tape head module Grant 9,767,833 - Brown , et al. September 19, 2	2017-09-19
Common ground for electronic lapping guides Grant 9,095,951 - Gee , et al. August 4, 2	2015-08-04
Correcting current crowding in row bar and vias for single pad bonding Grant 8,956,201 - Druist , et al. February 17, 2	2015-02-17
Wafer grounding design for single pad lapping Grant 8,956,200 - Druist , et al. February 17, 2	2015-02-17
Wafer Grounding Design For Single Pad Lapping App 20140154952 - DRUIST; David P. ; et al.	2014-06-05
Correcting Current Crowding In Row Bar And Vias For Single Pad Bonding App 20140154953 - DRUIST; David P. ; et al.	2014-06-05
Common Ground For Electronic Lapping Guides App 20140154951 - Gee; Glen P. ; et al.	2014-06-05
Lapping method and station to achieve tight dimension controls for both read and write elements of magnetic recording heads and magnetic storage device formed thereby Grant 8,390,962 - Gunder , et al. March 5, 2	2013-03-05
Lapping plate texture for increased control over actual lapping force Grant 7,662,021 - Gee , et al. February 16, 2	2010-02-16
Lapping plate texture for increased control over actual lapping force App 20080259492 - Gee; Glenn P. ; et al.	2008-10-23
Lapping method and station to achieve tight dimension controls for both read and write elements of magnetic recording heads and magnetic storage device formed thereby App 20070070543 - Gunder; Jeffrey P. ; et al.	2007-03-29

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