Smith; Craig G.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Smith; Craig G..The latest application filed is for "in-line solder seal for optical fiber".
- Smith; Craig G. - Trexlertown PA
- Smith; Craig G. - Bridgewater NJ
- Smith; Craig G. - North Plainfield NJ
| Patent | Date |
|---|---|
| In-line solder seal for optical fiber Grant 6,088,504 - Filas , et al. July 11, 2 | 2000-07-11 |
| Uniformity of copper etching in the fabrication of multilayer printed circuit boards Grant 5,127,991 - Lal , et al. July 7, 1 | 1992-07-07 |
| Solution monitoring procedure Grant 4,844,608 - Smith July 4, 1 | 1989-07-04 |
| Electroplating process with inert anodes Grant H36 - Smith March 4, 1 | 1986-03-04 |
| Copper electroplating process Grant 4,469,564 - Okinaka , et al. September 4, 1 | 1984-09-04 |
| Copper electroplating procedure Grant 4,445,980 - Smith May 1, 1 | 1984-05-01 |
| Electrolytic gold plating Grant 4,310,391 - Okinaka , et al. January 12, 1 | 1982-01-12 |
| Electrode for electrochemical processes Grant 4,269,670 - Smith May 26, 1 | 1981-05-26 |
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