Patent | Date |
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Through Wafer Trench Isolation and Capacitive Coupling App 20220148912 - Summerfelt; Scott Robert ;   et al. | 2022-05-12 |
Semiconductor devices and methods and apparatus to produce such semiconductor devices Grant 11,296,016 - Neidorff , et al. April 5, 2 | 2022-04-05 |
Piezoelectric resonator with patterned resonant confiners Grant 11,264,970 - Segovia Fernandez , et al. March 1, 2 | 2022-03-01 |
Through wafer trench isolation between transistors in an integrated circuit Grant 11,251,138 - Summerfelt , et al. February 15, 2 | 2022-02-15 |
Using acoustic reflector to reduce spurious modes Grant 11,190,164 - Yen , et al. November 30, 2 | 2021-11-30 |
Using Acoustic Reflector to Reduce Spurious Modes App 20200373908 - Yen; Ting-Ta ;   et al. | 2020-11-26 |
MEMS gap control structures Grant 10,829,367 - Shin , et al. November 10, 2 | 2020-11-10 |
Method And Structure To Reduce Impact Of External Stress And Aging Of A Baw Resonator App 20200350889 - Smeys; Peter ;   et al. | 2020-11-05 |
Piezoelectric Resonaor with Patterned Resonant Confiners App 20200280300 - Segovia Fernandez; Jeronimo ;   et al. | 2020-09-03 |
Micromachined ultrasound transducer Grant 10,751,754 - Najar , et al. A | 2020-08-25 |
Thermal and stress isolation for precision circuit Grant 10,727,161 - Smeys , et al. | 2020-07-28 |
Methods and apparatus to measure resonant sensors based on detection of group delay Grant 10,727,815 - Segovia Fernandez , et al. | 2020-07-28 |
Highly Dispersive Bulk Acoustic Wave Resonators App 20200212880 - SEGOVIA FERNANDEZ; Jeronimo ;   et al. | 2020-07-02 |
Through Wafer Trench Isolation and Capacitive Coupling App 20200203290 - Summerfelt; Scott Robert ;   et al. | 2020-06-25 |
Lamb Wave Resonator-based Torque Sensor App 20200186120 - SEGOVIA FERNANDEZ; Jeronimo ;   et al. | 2020-06-11 |
Methods And Apparatus To Measure Resonant Sensors Based On Detection Of Group Delay App 20200186130 - Segovia Fernandez; Jeronimo ;   et al. | 2020-06-11 |
Multi-frequency Hybrid Piezo Actuation And Capactive Transducer App 20200147642 - Motieian Najar; Mohammad Hadi ;   et al. | 2020-05-14 |
3D integration using Al--Ge eutectic bond interconnect Grant 10,651,151 - Smeys , et al. | 2020-05-12 |
Piezoelectric Accelerometer App 20200132540 - SUMMERFELT; Scott Robert ;   et al. | 2020-04-30 |
Thermal And Stress Isolation For Precision Circuit App 20200043828 - Smeys; Peter ;   et al. | 2020-02-06 |
Laterally Vibrating Bulk Acoustic Wave Resonator App 20200021272 - Segovia Fernandez; Jeronimo ;   et al. | 2020-01-16 |
Mems Gap Control Structures App 20190241432 - SHIN; Jong Il ;   et al. | 2019-08-08 |
Acoustic Isolator App 20190229254 - SMEYS; Peter ;   et al. | 2019-07-25 |
Method And Structure To Eliminate Substrate Coupling In Common Drain Devices App 20190206741 - PODDAR; Anindya ;   et al. | 2019-07-04 |
Inductive Humidity Sensor And Method App 20190204269 - Smeys; Peter ;   et al. | 2019-07-04 |
Dual cavity pressure structures Grant 10,308,503 - Shin , et al. | 2019-06-04 |
MEMS gap control structures Grant 10,308,507 - Shin , et al. | 2019-06-04 |
Semiconductor Devices And Methods And Apparatus To Produce Such Semiconductor Devices App 20190139868 - Neidorff; Robert Allan ;   et al. | 2019-05-09 |
CMOS-MEMS integrated device including multiple cavities at different controlled pressures and methods of manufacture Grant 10,221,065 - Lee , et al. | 2019-03-05 |
Micromachined Ultrasound Transducer App 20190030569 - NAJAR; Mohammad Hadi Motieian ;   et al. | 2019-01-31 |
CMOS-MEMS-CMOS platform Grant 10,093,533 - Smeys , et al. October 9, 2 | 2018-10-09 |
Method And System For Mems Devices With Dual Damascene Formed Electrodes App 20180222745 - Huang; Chunchieh ;   et al. | 2018-08-09 |
Integration of AIN ultrasonic transducer on a CMOS substrate using fusion bonding process Grant 9,975,763 - Shin , et al. May 22, 2 | 2018-05-22 |
Method and system for MEMS devices with dual damascene formed electrodes Grant 9,919,915 - Huang , et al. March 20, 2 | 2018-03-20 |
Methods for fabricating integrated circuits with triple gate oxide devices Grant 9,892,922 - Cheng , et al. February 13, 2 | 2018-02-13 |
Cmos-mems-cmos Platform App 20180009654 - SMEYS; Peter ;   et al. | 2018-01-11 |
MEMS-CMOS device that minimizes outgassing and methods of manufacture Grant 9,862,593 - Smeys , et al. January 9, 2 | 2018-01-09 |
Method And System For Mems Devices With Dual Damascene Formed Electrodes App 20170355593 - Huang; Chunchieh ;   et al. | 2017-12-14 |
3D INTEGRATION USING Al-Ge EUTECTIC BOND INTERCONNECT App 20170330863 - Smeys; Peter ;   et al. | 2017-11-16 |
CMOS-MEMS integration using metal silicide formation Grant 9,809,450 - Shin , et al. November 7, 2 | 2017-11-07 |
CMOS-MEMS-CMOS platform Grant 9,796,580 - Smeys , et al. October 24, 2 | 2017-10-24 |
Mems Gap Control Structures App 20170297911 - SHIN; Jong II ;   et al. | 2017-10-19 |
Dual Cavity Pressure Structures App 20170297909 - Shin; Jong Il ;   et al. | 2017-10-19 |
Integration Of Ain Ultrasonic Transducer On A Cmos Substrate Using Fusion Bonding Process App 20170275158 - Shin; Jong Il ;   et al. | 2017-09-28 |
CMOS-MEMS integration by sequential bonding method Grant 9,761,557 - Shin , et al. September 12, 2 | 2017-09-12 |
3D integration using Al--Ge eutectic bond interconnect Grant 9,754,922 - Smeys , et al. September 5, 2 | 2017-09-05 |
CMOS-MEMS integrated device including multiple cavities at different controlled pressures and methods of manufacture Grant 9,738,512 - Lee , et al. August 22, 2 | 2017-08-22 |
Dual cavity pressure structures Grant 9,725,305 - Shin , et al. August 8, 2 | 2017-08-08 |
CMOS-MEMS integrated device including a contact layer and methods of manufacture Grant 9,718,680 - Lee , et al. August 1, 2 | 2017-08-01 |
Variable gate width FinFET Grant 9,698,252 - Gupta , et al. July 4, 2 | 2017-07-04 |
Cmos-mems Integrated Device Including Multiple Cavities At Different Controlled Pressures And Methods Of Manufacture App 20170183225 - LEE; Daesung ;   et al. | 2017-06-29 |
MEMS sensor integrated with a flip chip Grant 9,611,137 - Smeys , et al. April 4, 2 | 2017-04-04 |
Mems-cmos Device That Minimizes Outgassing And Methods Of Manufacture App 20170073217 - SMEYS; Peter ;   et al. | 2017-03-16 |
Cmos-mems Integration Using Metal Silicide Formation App 20170057813 - SHIN; Jong Il ;   et al. | 2017-03-02 |
MEMS-CMOS device that minimizes outgassing and methods of manufacture Grant 9,540,228 - Smeys , et al. January 10, 2 | 2017-01-10 |
Variable gate width FinFET Grant 9,525,068 - Gupta , et al. December 20, 2 | 2016-12-20 |
Cmos-mems-cmos Platform App 20160362293 - SMEYS; Peter ;   et al. | 2016-12-15 |
Cmos-mems Integrated Device Including A Contact Layer And Methods Of Manufacture App 20160362296 - LEE; Daesung ;   et al. | 2016-12-15 |
Dual Cavity Pressure Structures App 20160272486 - Shin; Jong II ;   et al. | 2016-09-22 |
Integrated CMOS and MEMS sensor fabrication method and structure Grant 9,422,156 - Smeys August 23, 2 | 2016-08-23 |
3D INTEGRATION USING Al-Ge EUTECTIC BOND INTERCONNECT App 20160233197 - Smeys; Peter ;   et al. | 2016-08-11 |
Mems-cmos Device That Minimizes Outgassing And Methods Of Manufacture App 20160221819 - SMEYS; Peter ;   et al. | 2016-08-04 |
Metal-insulator-metal capacitors between metal interconnect layers Grant 9,331,137 - Ratakonda , et al. May 3, 2 | 2016-05-03 |
Internal Barrier For Enclosed Mems Devices App 20160075554 - HUANG; Anatole ;   et al. | 2016-03-17 |
Mems Sensor Integrated With A Flip Chip App 20160060100 - SMEYS; Peter ;   et al. | 2016-03-03 |
Integrated Cmos And Mems Sensor Fabrication Method And Structure App 20160002028 - SMEYS; Peter | 2016-01-07 |
Cmos-mems Integration By Sequential Bonding Method App 20150311178 - SHIN; Jong Il ;   et al. | 2015-10-29 |
Method To Improve Surface Roughness And Eliminate Sharp Corners On An Actuator Layer Of A Mems Device App 20150274517 - SMEYS; Peter ;   et al. | 2015-10-01 |
Cmos-mems Integrated Device Including Multiple Cavities At Different Controlled Pressures And Methods Of Manufacture App 20150129991 - LEE; Daesung ;   et al. | 2015-05-14 |
Integrated circuit resistors with reduced parasitic capacitance Grant 8,878,334 - Ratnakumar , et al. November 4, 2 | 2014-11-04 |
Integrated circuit micro-module Grant 8,822,266 - Smeys , et al. September 2, 2 | 2014-09-02 |
Methods for fabricating deep trench capacitors Grant 8,609,486 - Smeys , et al. December 17, 2 | 2013-12-17 |
Integrated circuit micro-module Grant 8,482,118 - Mohan , et al. July 9, 2 | 2013-07-09 |
Method of forming a MEMS power inductor Grant 8,443,511 - Smeys , et al. May 21, 2 | 2013-05-21 |
Magnetically enhanced power inductor with self-aligned hard axis magnetic core produced in an applied magnetic field using a damascene process sequence Grant 8,407,883 - Smeys , et al. April 2, 2 | 2013-04-02 |
Inductive structure and method of forming the inductive structure with an attached core structure Grant 8,410,576 - Smeys , et al. April 2, 2 | 2013-04-02 |
System And Method Of Galvanic Isolation In Digital Signal Transfer Integrated Circuits Utilizing Conductivity Modulation Of Semiconductor Substrate App 20130062725 - Hopper; Peter J. ;   et al. | 2013-03-14 |
System and method of galvanic isolation in digital signal transfer integrated circuits utilizing conductivity modulation of semiconductor substrate Grant 8,390,093 - Hopper , et al. March 5, 2 | 2013-03-05 |
Method of forming high capacitance semiconductor capacitors with a single lithography step Grant 8,377,792 - Hopper , et al. February 19, 2 | 2013-02-19 |
Method of batch trimming circuit elements Grant 8,378,460 - Hopper , et al. February 19, 2 | 2013-02-19 |
Semiconductor inductor with a serpentine shaped conductive wire interlaced with a serpentine shaped ferromagnetic core Grant 8,338,913 - Smeys , et al. December 25, 2 | 2012-12-25 |
Method of making a controlled seam laminated magnetic core for high frequency on-chip power inductors Grant 8,314,676 - Smeys , et al. November 20, 2 | 2012-11-20 |
Method Of Making A Controlled Seam Laminated Magnetic Core For High Frequency On-chip Power Inductors App 20120280781 - Smeys; Peter ;   et al. | 2012-11-08 |
Power transistor with improved high-side operating characteristics and reduced resistance and related apparatus and method Grant 8,274,129 - French , et al. September 25, 2 | 2012-09-25 |
Magnetically Enhanced Power Inductor With Self-aligned Hard Axis Magnetic Core Produced In An Applied Magnetic Field Using A Damascene Process Sequence App 20120233849 - Smeys; Peter ;   et al. | 2012-09-20 |
Bonded Semiconductor Structure With Pyramid-Shaped Alignment Openings and Projections App 20120217610 - Hopper; Peter J. ;   et al. | 2012-08-30 |
Integrated Circuit Micro-module App 20120217625 - Mohan; Anuraag ;   et al. | 2012-08-30 |
Method and system for forming a capacitive micromachined ultrasonic transducer Grant 8,222,065 - Smeys , et al. July 17, 2 | 2012-07-17 |
Method of Batch Trimming Circuit Elements App 20120161294 - Hopper; Peter J. ;   et al. | 2012-06-28 |
Method of fabricating an inductor structure Grant 8,205,324 - Smeys , et al. June 26, 2 | 2012-06-26 |
Integrated circuit micro-module Grant 8,187,920 - Mohan , et al. May 29, 2 | 2012-05-29 |
Semiconductor Inductor with a Serpentine Shaped Conductive Wire and a Serpentine Shaped Ferromagnetic Core and a Method of Forming the Semiconductor Inductor App 20120112296 - Smeys; Peter ;   et al. | 2012-05-10 |
High frequency semiconductor transformer Grant 8,130,067 - Lee , et al. March 6, 2 | 2012-03-06 |
Method of Forming a MEMS Power Inductor App 20120009689 - Smeys; Peter ;   et al. | 2012-01-12 |
Galvanic Isolation Transformer App 20120002377 - French; William ;   et al. | 2012-01-05 |
Inductive Structure and Method of Forming the Inductive Structure with an Attached Core Structure App 20110310579 - Smeys; Peter ;   et al. | 2011-12-22 |
High Frequency Semiconductor Transformer App 20110279214 - Lee; Dok Won ;   et al. | 2011-11-17 |
Method And Structure For Improving The Qualilty Factor Of Rf Inductors App 20110272780 - Smeys; Peter ;   et al. | 2011-11-10 |
Method of forming a MEMS topped integrated circuit with a stress relief layer Grant 8,048,704 - Smeys , et al. November 1, 2 | 2011-11-01 |
SOI Wafer and Method of Forming the SOI Wafer with Through the Wafer Contacts and Trench Based Interconnect Structures that Electrically Connect the Through the Wafer Contacts App 20110260248 - Smeys; Peter ;   et al. | 2011-10-27 |
Methods of forming inductors on integrated circuits Grant 8,042,260 - Hopper , et al. October 25, 2 | 2011-10-25 |
MEMS power inductor Grant 8,044,755 - Smeys , et al. October 25, 2 | 2011-10-25 |
Method of Forming High Capacitance Semiconductor Capacitors with a Single Lithography Step App 20110250730 - Hopper; Peter J. ;   et al. | 2011-10-13 |
Integrated Circuit Micro-module App 20110163457 - Mohan; Anuraag ;   et al. | 2011-07-07 |
Integrated Circuit Micro-module App 20110115071 - Smeys; Peter ;   et al. | 2011-05-19 |
On-chip inductor for high current applications Grant 7,936,246 - Hopper , et al. May 3, 2 | 2011-05-03 |
Power transistor with improved high-side operating characteristics and reduced resistance and related apparatus and method App 20110095365 - French; William ;   et al. | 2011-04-28 |
Integrated circuit micro-module Grant 7,902,661 - Smeys , et al. March 8, 2 | 2011-03-08 |
Integrated circuit micro-module Grant 7,901,981 - Smeys , et al. March 8, 2 | 2011-03-08 |
Integrated circuit micro-module Grant 7,901,984 - Smeys , et al. March 8, 2 | 2011-03-08 |
Integrated circuit micro-module Grant 7,898,068 - Smeys , et al. March 1, 2 | 2011-03-01 |
Integrated circuit micro-module Grant 7,843,056 - Smeys , et al. November 30, 2 | 2010-11-30 |
Integrated circuit micro-module Grant 7,842,544 - Smeys , et al. November 30, 2 | 2010-11-30 |
Integrated Circuit Micro-module App 20100216280 - SMEYS; Peter ;   et al. | 2010-08-26 |
Integrated Circuit Micro-module App 20100213603 - SMEYS; Peter ;   et al. | 2010-08-26 |
Integrated Circuit Micro-module App 20100213602 - SMEYS; Peter ;   et al. | 2010-08-26 |
Integrated Circuit Micro-module App 20100213601 - SMEYS; Peter ;   et al. | 2010-08-26 |
Integrated Circuit Micro-module App 20100213607 - SMEYS; Peter ;   et al. | 2010-08-26 |
Integrated Circuit Micro-module App 20100213604 - SMEYS; Peter ;   et al. | 2010-08-26 |
Method of Forming a MEMS Topped Integrated Circuit with a Stress Relief Layer App 20100190311 - Smeys; Peter ;   et al. | 2010-07-29 |
Integrated circuits with inductors Grant 7,755,463 - Hopper , et al. July 13, 2 | 2010-07-13 |
MEMS-topped integrated circuit with a stress relief layer Grant 7,705,411 - Smeys , et al. April 27, 2 | 2010-04-27 |
Cmos Compatible Integrated High Density Capacitor Structure And Process Sequence App 20100079929 - Smeys; Peter ;   et al. | 2010-04-01 |
MEMS-topped integrated circuit with a stress relief layer and method of forming the circuit App 20090256236 - Smeys; Peter ;   et al. | 2009-10-15 |
MEMS power inductor and method of forming the MEMS power inductor App 20090256667 - Smeys; Peter ;   et al. | 2009-10-15 |
Method of fabricating an inductor structure on an integrated circuit structure Grant 7,584,533 - Smeys , et al. September 8, 2 | 2009-09-08 |
Magnetically Enhanced Power Inductor With Self-aligned Hard Axis Magnetic Core Produced In An Applied Magnetic Field Using A Damascene Process Sequence App 20090181473 - Smeys; Peter ;   et al. | 2009-07-16 |
Helical core on-chip power inductor App 20090160592 - Hopper; Peter J. ;   et al. | 2009-06-25 |
Magnetically enhanced power inductor with self-aligned hard axis magnetic core produced using a damascene process sequence App 20090094818 - Smeys; Peter ;   et al. | 2009-04-16 |
On-chip inductor for high current applications App 20090091414 - Hopper; Peter J. ;   et al. | 2009-04-09 |
Integrated Circuits With Inductors App 20090040000 - Hopper; Peter J. ;   et al. | 2009-02-12 |
Methods Of Forming Inductors On Integrated Circuits App 20090038142 - HOPPER; Peter J. ;   et al. | 2009-02-12 |
Apparatus and method for wafer level fabrication of high value inductors on semiconductor integrated circuits Grant 7,468,899 - Hopper , et al. December 23, 2 | 2008-12-23 |
System and method for detecting and preventing race condition in circuits Grant 7,461,305 - Klass , et al. December 2, 2 | 2008-12-02 |
Triple oxide fill for trench isolation Grant 6,825,097 - Beyer , et al. November 30, 2 | 2004-11-30 |
Triple oxide fill for trench isolation App 20040029352 - Beyer, Klaus D. ;   et al. | 2004-02-12 |
Fuse structure with thermal and crack-stop protection Grant 6,653,710 - Adkisson , et al. November 25, 2 | 2003-11-25 |
Pair of FETs including a shared SOI body contact and the method of forming the FETs Grant 6,613,615 - Mandelman , et al. September 2, 2 | 2003-09-02 |
Anti-spacer structure for self-aligned independent gate implantation Grant 6,531,365 - Dokumaci , et al. March 11, 2 | 2003-03-11 |
Partially Removable Spacer With Salicide Formation App 20030042551 - AGNELLO, PAUL D. ;   et al. | 2003-03-06 |
Anti-spacer Structure For Self-aligned Independent Gate Implantation App 20020197839 - Dokumaci, Omer H. ;   et al. | 2002-12-26 |
Fuse structure with thermal and crack-stop protection App 20020113291 - Adkisson, James W. ;   et al. | 2002-08-22 |
SOI CMOS dynamic circuits having threshold voltage control Grant 6,433,587 - Assaderaghi , et al. August 13, 2 | 2002-08-13 |
Semiconductor Transistor With Multi-depth Source Drain App 20020053700 - BALLANTINE, ARNE WATSON ;   et al. | 2002-05-09 |
Pair of FETs including a shared SOI body contact and the method of forming the FETs App 20020020877 - Mandelman, Jack A. ;   et al. | 2002-02-21 |
Pair of FETs including a shared SOI body contact and the method of forming the FETs Grant 6,344,671 - Mandelman , et al. February 5, 2 | 2002-02-05 |
Electrical fuses employing reverse biasing to enhance programming Grant 6,323,535 - Iyer , et al. November 27, 2 | 2001-11-27 |
Partially removable spacer with salicide formation App 20010041398 - Angello, Paul D. ;   et al. | 2001-11-15 |