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Reduced-warpage laminate structure
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Shielded Package Assemblies With Integrated Capacitor
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Shielded package assemblies with integrated capacitor
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Shielded package assemblies with integrated capacitor
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Shielded Package Assemblies With Integrated Capacitor
App 20180068957 - Lamorey; Mark C. ; et al. | 2018-03-08 |
Reduced-warpage Laminate Structure
App 20170148749 - Lamorey; Mark C. ; et al. | 2017-05-25 |
Shielded Package Assemblies With Integrated Capacitor
App 20170125358 - Lamorey; Mark C. ; et al. | 2017-05-04 |
Reduced-warpage laminate structure
Grant 9,613,915 - Lamorey , et al. April 4, 2 | 2017-04-04 |
Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structures
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Reduced-warpage laminate structure
Grant 9,543,255 - Lamorey , et al. January 10, 2 | 2017-01-10 |
Shielded package assemblies with integrated capacitor
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Reduced-warpage Laminate Structure
App 20160157357 - Lamorey; Mark C. ; et al. | 2016-06-02 |
Reduced-warpage Laminate Structure
App 20160155708 - Lamorey; Mark C. ; et al. | 2016-06-02 |
Packages for three-dimensional die stacks
Grant 9,252,101 - Lamorey , et al. February 2, 2 | 2016-02-02 |
Organic module EMI shielding structures and methods
Grant 9,245,854 - Brodsky , et al. January 26, 2 | 2016-01-26 |
Shielded package assemblies with integrated capacitor
Grant 9,209,141 - Lamorey , et al. December 8, 2 | 2015-12-08 |
Shielded Package Assemblies With Integrated Capacitor
App 20150349565 - Lamorey; Mark C. ; et al. | 2015-12-03 |
Thermally enhanced three-dimensional integrated circuit package
Grant 9,190,399 - Lamorey , et al. November 17, 2 | 2015-11-17 |
Integrated circuit structures having off-axis in-hole capacitor
Grant 9,185,807 - Lamorey , et al. November 10, 2 | 2015-11-10 |
Thermally Enhanced Three-dimensional Integrated Circuit Package
App 20150255441 - Lamorey; Mark C. ; et al. | 2015-09-10 |
Circuit For Detecting Structural Defects In An Integrated Circuit Chip, Methods Of Use And Manufacture And Design Structures
App 20150247896 - Lacroix; Luke D. ; et al. | 2015-09-03 |
Integrated Circuit Structures Having Off-axis In-hole Capacitor
App 20150245491 - Lamorey; Mark C. ; et al. | 2015-08-27 |
Shielded Package Assemblies With Integrated Capacitor
App 20150243609 - Lamorey; Mark C. ; et al. | 2015-08-27 |
Packages For Three-dimensional Die Stacks
App 20150214155 - Lamorey; Mark C. ; et al. | 2015-07-30 |
Integrated Circuit Structures Having Off-axis In-hole Capacitor And Methods Of Forming
App 20150195914 - Lamorey; Mark C. ; et al. | 2015-07-09 |
Packages For Three-dimensional Die Stacks
App 20150194364 - Lamorey; Mark C. ; et al. | 2015-07-09 |
Integrated circuit structures having off-axis in-hole capacitor and methods of forming
Grant 9,078,373 - Lamorey , et al. July 7, 2 | 2015-07-07 |
Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structures
Grant 9,057,760 - Lacroix , et al. June 16, 2 | 2015-06-16 |
Packages for three-dimensional die stacks
Grant 9,059,127 - Lamorey , et al. June 16, 2 | 2015-06-16 |
Power distribution for 3D semiconductor package
Grant 9,018,040 - Lamorey , et al. April 28, 2 | 2015-04-28 |
Elongated via structures
Grant 8,999,846 - LaCroix , et al. April 7, 2 | 2015-04-07 |
Power Distribution For 3d Semiconductor Package
App 20150091131 - Lamorey; Mark C. ; et al. | 2015-04-02 |
Organic module EMI shielding structures and methods
Grant 8,952,503 - Brodsky , et al. February 10, 2 | 2015-02-10 |
Organic Module Emi Shielding Structures And Methods
App 20150033554 - Brodsky; William L. ; et al. | 2015-02-05 |
Elongated Via Structures
App 20140227874 - LaCroix; Luke D. ; et al. | 2014-08-14 |
Organic Module Emi Shielding Structures And Methods
App 20140210059 - Brodsky; William L. ; et al. | 2014-07-31 |
Elongated via structures
Grant 8,759,977 - LaCroix , et al. June 24, 2 | 2014-06-24 |
Structure for monitoring stress induced failures in interlevel dielectric layers of solder bump integrated circuits
Grant 8,653,662 - LaCroix , et al. February 18, 2 | 2014-02-18 |
Semiconductor test chip device to mimic field thermal mini-cycles to assess reliability
Grant 8,586,982 - LaCroix , et al. November 19, 2 | 2013-11-19 |
Structure And Method For Monitoring Stress Induced Failures In Interlevel Dielectric Layers Of Solder Bump Integrated Circuits
App 20130292817 - LaCroix; Luke D. ; et al. | 2013-11-07 |
Elongated Via Structures
App 20130285251 - LaCroix; Luke D. ; et al. | 2013-10-31 |
Uniform solder reflow fixture
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Circuit For Detecting Structural Defects In An Integrated Circuit Chip, Methods Of Use And Manufacture And Design Structures
App 20120187953 - LACROIX; Luke D. ; et al. | 2012-07-26 |
Integrated Circuit Package Using Through Substrate Vias To Ground Lid
App 20120074559 - Budell; Timothy W. ; et al. | 2012-03-29 |
Semiconductor Test Chip Device To Mimic Field Thermal Mini-cycles To Assess Reliability
App 20120049874 - LaCroix; Luke D. ; et al. | 2012-03-01 |
Roughening surface of a substrate
Grant 4,615,763 - Gelorme , et al. October 7, 1 | 1986-10-07 |
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