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name:-0.0085198879241943
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Slominski; Leo J. Patent Filings

Slominski; Leo J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Slominski; Leo J..The latest application filed is for "method for electroless deposition of copper on conductive surfaces and on substrates containing conductive surfaces".

Company Profile
0.6.0
  • Slominski; Leo J. - Bristol CT
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method for electroless deposition of copper on conductive surfaces and on substrates containing conductive surfaces
Grant 4,671,968 - Slominski June 9, 1
1987-06-09
Method and composition for electroless nickel deposition
Grant 4,600,609 - Leever , et al. July 15, 1
1986-07-15
Apparatus and method for automatically maintaining an electroless copper plating bath
Grant RE31,694 - Slominski , et al. October 2, 1
1984-10-02
Apparatus and method for automatically maintaining an electroless copper plating bath
Grant 4,096,301 - Slominski , et al. June 20, 1
1978-06-20
Electroless And Electrolytic Copper Plating
Grant 3,819,497 - Grunwald , et al. June 25, 1
1974-06-25
Thiosulfate Copper Plating
Grant 3,617,451 - Slominski , et al. November 2, 1
1971-11-02

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