Slater; David B. JR.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Slater; David B. JR..The latest application filed is for "light emitting diodes including transparent oxide layers".

Company Profile

0.0.31

Slater; David B. JR. - Raleigh NC
Slater; David B. JR. - Durham NC

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Light Emitting Diodes Including Transparent Oxide Layers App 20070284604 - Slater; David B. JR. ; et al.	2007-12-13
Methods Of Manufacturing Light Emitting Diodes Including Barrier Layers/sublayers App 20070161137 - Slater; David B. JR. ; et al.	2007-07-12
Systems for assembling components on submounts and methods therefor App 20070034323 - Hiller; Norbert ; et al.	2007-02-15
External extraction light emitting diode based upon crystallographic faceted surfaces App 20060186418 - Edmond; John A. ; et al.	2006-08-24
Light emitting diodes including pedestals App 20060131599 - Slater; David B. JR. ; et al.	2006-06-22
Semiconductor light emitting device mounting substrates and packages including cavities and cover plates, and methods of packaging same App 20060124953 - Negley; Gerald H. ; et al.	2006-06-15
LED fabrication via ion implant isolation App 20060108595 - Wu; Yifeng ; et al.	2006-05-25
LED fabrication via ion implant isolation App 20050285126 - Wu, Yifeng ; et al.	2005-12-29
Light emitting diodes including barrier layers/sublayers and manufacturing methods therefor App 20050194603 - Slater, David B. JR. ; et al.	2005-09-08
Methods of processing semiconductor wafer backsides having light emitting devices (LEDS) thereon and leds so formed App 20050151138 - Slater, David B. JR. ; et al.	2005-07-14
Pattern for improved visual inspection of semiconductor devices App 20050118738 - Tuttle, Ralph C. ; et al.	2005-06-02
Localized annealing of metal-silicon carbide ohmic contacts and devices so formed App 20050104072 - Slater, David B. JR. ; et al.	2005-05-19
Methods of Treating a Silicon Carbide Substrate for Improved Epitaxial Deposition and Resulting Structures and Devices App 20050029526 - McClure, Davis Andrew ; et al.	2005-02-10
LED fabrication via ion implant isolation App 20050029533 - Wu, Yifeng ; et al.	2005-02-10
Flip-chip bonding of light emitting devices App 20050017256 - Slater, David B. JR. ; et al.	2005-01-27
Methods of fabricating light emitting devices using mesa regions and passivation layers App 20050019971 - Slater, David B. JR. ; et al.	2005-01-27
Vertical geometry InGaN LED App 20040232433 - Doverspike, Kathleen Marie ; et al.	2004-11-25
Light emitting diodes including pedestals App 20040217362 - Slater, David B. JR. ; et al.	2004-11-04
Bonding Of Light Emitting Diodes Having Shaped Substrates App 20040200882 - Slater, David B. JR. ; et al.	2004-10-14
Low temperature formation of backside ohmic contacts for vertical devices App 20040171204 - Slater, David B. JR. ; et al.	2004-09-02
Systems for assembling components on submounts and methods therefor App 20040118512 - Hiller, Norbert ; et al.	2004-06-24
Phosphor-coated light emitting diodes including tapered sidewalls, and fabrication methods therefor App 20040056260 - Slater, David B. JR. ; et al.	2004-03-25
Robust group III light emitting diode for high reliability in standard packaging applications App 20040026707 - Slater, David B. JR. ; et al.	2004-02-12
Reflective ohmic contacts for silicon carbide including a layer consisting essentially of nickel, methods of fabricating same, and light emitting devices including the same App 20030168663 - Slater, David B. JR. ; et al.	2003-09-11
Cluster Packaging Of Light Emitting Diodes App 20030143767 - Andrews, Peter S. ; et al.	2003-07-31
Pattern for improved visual inspection of semiconductor devices App 20030076489 - Tuttle, Ralph C. ; et al.	2003-04-24
Bonding of light emitting diodes having shaped substrates and collets for bonding of light emitting diodes having shaped substrates App 20030042507 - Slater, David B. JR. ; et al.	2003-03-06
Flip-chip bonding of light emitting devices and light emitting devices suitable for flip-chip bonding App 20030045015 - Slater, David B. JR. ; et al.	2003-03-06
Light emitting diodes including modifications for submount bonding and manufacturing methods therefor App 20030015721 - Slater,, David B. JR. ; et al.	2003-01-23
Low temperature formation of backside ohmic contacts for vertical devices App 20020179910 - Slater, David B. JR.	2002-12-05
Light emitting diodes including modifications for light extraction and manufacturing methods therefor App 20020123164 - Slater, David B. JR. ; et al.	2002-09-05

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