SKY TECH INC.

Patent Applications and Registrations

Patent applications and USPTO patent grants for SKY TECH INC..The latest application filed is for "laser lift-off method for separating substrate and semiconductor-epitaxial structure".

Company Profile

5.8.19

SKY TECH INC. - Hsinchu County TW
SKY TECH INC. - Hsinchu Count TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Shielding Mechanism And Substrate-processing Device With The Same App 20220282378 - LIN; JING-CHENG ; et al.	2022-09-08
Atomic Layer Deposition Device App 20220282373 - LIN; JING-CHENG	2022-09-08
Laser Lift-off Method For Separating Substrate And Semiconductor-epitaxial Structure App 20220285218 - LIN; JING-CHENG ; et al.	2022-09-08
Shower Head Assembly And Atomic Layer Deposition Device App 20220282376 - LIN; JING-CHENG ; et al.	2022-09-08
Atomic layer deposition equipment capable of reducing precursor deposition and atomic layer deposition process method using the same Grant 11,427,910 - Lin , et al. August 30, 2	2022-08-30
Wafer-holding Device And Deposition Equipment Using The Same App 20220267901 - LIN; JING-CHENG	2022-08-25
Wafer-holding Device And Thin-film-deposition Equipment Using The Same App 20220270913 - LIN; JING-CHENG ; et al.	2022-08-25
Atomic layer deposition equipment and process method Grant 11,401,608 - Lin , et al. August 2, 2	2022-08-02
Wafer Support And Thin-film Deposition Apparatus Using The Same App 20220220615 - LIN; JING-CHENG ; et al.	2022-07-14
Semiconductor Component With Oxidized Aluminum Nitride Film And Manufacturing Method Thereof App 20220199860 - LIN; JING-CHENG	2022-06-23
Manufacturing Method And Manufacturing Machine For Reducing Non-radiative Recombination Of Micro Led App 20220199675 - LIN; JING-CHENG	2022-06-23
Wafer Holder For Generating Stable Bias Voltage And Thin Film Deposition Equipment Using The Same App 20220181195 - LIN; JING-CHENG ; et al.	2022-06-09
Substrate Transfer System With Tray Aligner App 20220165600 - LIN; JING-CHENG ; et al.	2022-05-26
Powder Atomic Layer Deposition Apparatus With Special Cover Lid App 20220162750 - LIN; JING-CHENG ; et al.	2022-05-26
Atomic layer deposition equipment and process method Grant 11,332,826 - Lin , et al. May 17, 2	2022-05-17
Powder Atomic Layer Deposition Apparatus For Blowing Powders App 20220136103 - LIN; JING-CHENG ; et al.	2022-05-05
Substrate transfer system with tray aligner Grant 11,322,380 - Lin , et al. May 3, 2	2022-05-03
Alignment Mechanism And Alignment Method Of Bonding Machine App 20220122868 - LIN; JING-CHENG ; et al.	2022-04-21
Atomic Layer Deposition Apparatus For Coating On Fine Powders App 20220106685 - LIN; JING-CHENG ; et al.	2022-04-07
Detachable Atomic Layer Deposition Apparatus For Powders App 20220106686 - LIN; JING-CHENG ; et al.	2022-04-07
Atomic Layer Deposition Apparatus For Coating On Fine Powders App 20220106684 - LIN; JING-CHENG ; et al.	2022-04-07
Atomic Layer Deposition Apparatus For Powders App 20220106682 - LIN; JING-CHENG ; et al.	2022-04-07
Wafer Support And Equipment For Thin-film Deposition Or Pre-cleaning Using The Same App 20220068612 - LIN; JING-CHENG ; et al.	2022-03-03

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