SKOGLUND; Lars D.

Patent Applications and Registrations

Patent applications and USPTO patent grants for SKOGLUND; Lars D..The latest application filed is for "underfill material flow control for reduced die-to-die spacing in semiconductor packages".

Company Profile

1.5.13

SKOGLUND; Lars D. - Chandler AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Underfill Material Flow Control For Reduced Die-to-die Spacing In Semiconductor Packages App 20190148268 - KARHADE; Omkar G. ; et al.	2019-05-16
Underfill material flow control for reduced die-to-die spacing in semiconductor packages Grant 10,192,810 - Karhade , et al. Ja	2019-01-29
Laser die backside film removal for integrated circuit (IC) packaging Grant 9,859,248 - Faruqui , et al. January 2, 2	2018-01-02
Ablation method and recipe for wafer level underfill material patterning and removal Grant 9,786,517 - Dias , et al. October 10, 2	2017-10-10
Inflatable Bladder Based Mechanical Testing for Stretchable Electronics App 20170269017 - KLEIN; Steven A. ; et al.	2017-09-21
Microelectronic die having chamfered corners Grant 9,508,660 - Dubey , et al. November 29, 2	2016-11-29
Laser Die Backside Film Removal For Integrated Circuit (ic) Packaging App 20160307869 - Faruqui; Danish ; et al.	2016-10-20
Microelectronic Die Having Chamfered Corners App 20160233175 - Dubey; Manish ; et al.	2016-08-11
Ablation Method And Recipe For Wafer Level Underfill Material Patterning And Removal App 20150072479 - Dias; Rajendra C. ; et al.	2015-03-12
Laser Ablation Method And Recipe For Sacrificial Material Patterning And Removal App 20150072515 - Dias; Rajendra C. ; et al.	2015-03-12
Underfill Material Flow Control For Reduced Die-to-die Spacing In Semiconductor Packages App 20150001717 - Karhade; Omkar G. ; et al.	2015-01-01
Laser Die Backside Film Removal For Integrated Circuit (ic) Packaging App 20140264951 - Faruqui; Danish ; et al.	2014-09-18
Electronic assembly having a die with rounded corner edge portions and a method of fabricating the same App 20050017371 - Wang, Zhiyong ; et al.	2005-01-27

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