Skipor; Andrew
Patent Applications and Registrations
Patent applications and USPTO patent grants for Skipor; Andrew.The latest application filed is for "apparatus for selectively backlighting a material".
- Skipor; Andrew - West Chicago IL
- Skipor; Andrew - Glendale Heights IL
| Patent | Date |
|---|---|
| Apparatus For Selectively Backlighting A Material App 20120195022 - Skipor; Andrew ; et al. | 2012-08-02 |
| Apparatus for selectively backlighting a material Grant 8,128,249 - Skipor , et al. March 6, 2 | 2012-03-06 |
| Apparatus For Selectively Backlighting A Material App 20090059554 - Skipor; Andrew ; et al. | 2009-03-05 |
| Method And Apparatus For Photoplethysmographic Sensing App 20090054752 - Jonnalagadda; Krishna ; et al. | 2009-02-26 |
| Encapsulated organic semiconductor device and method Grant 7,393,716 - Scheifers , et al. July 1, 2 | 2008-07-01 |
| Self-healing polymer compositions Grant 7,108,914 - Skipor , et al. September 19, 2 | 2006-09-19 |
| Encapsulated organic semiconductor device and method App 20050189537 - Scheifers, Steven ; et al. | 2005-09-01 |
| Apparel having multiple alternative sensors and corresponding method Grant 6,930,608 - Grajales , et al. August 16, 2 | 2005-08-16 |
| Self-healing polymer compositions App 20040007784 - Skipor, Andrew ; et al. | 2004-01-15 |
| Microelectronic assembly with die support and method App 20040002181 - Scheifers, Steven M. ; et al. | 2004-01-01 |
| Apparel having multiple alternative sensors and corresponding method App 20030214408 - Grajales, Liliana ; et al. | 2003-11-20 |
| Micro-electro mechanical system Grant 6,649,852 - Chason , et al. November 18, 2 | 2003-11-18 |
| Micro-electro mechanical system App 20030188958 - Chason, Marc ; et al. | 2003-10-09 |
| Encapsulated organic semiconductor device and method App 20030183915 - Scheifers, Steven ; et al. | 2003-10-02 |
| Microelectronic assembly with die support and method Grant 6,562,663 - Scheifers , et al. May 13, 2 | 2003-05-13 |
| Micro-electro mechanical system App 20030034239 - Chason, Marc ; et al. | 2003-02-20 |
| Microelectronic assembly with die support and method App 20020142514 - Scheifers, Steven M. ; et al. | 2002-10-03 |
| Microelectronic assembly including polymeric reinforcement on an integrated circuit die, and method for forming same Grant 5,895,976 - Morrell , et al. April 20, 1 | 1999-04-20 |
| Low temperature-wetting tin-base solder paste Grant 5,229,070 - Melton , et al. July 20, 1 | 1993-07-20 |
| Method for forming tin-indium or tin-bismuth solder connection having increased melting temperature Grant 5,221,038 - Melton , et al. June 22, 1 | 1993-06-22 |
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