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name:-0.015440940856934
name:-0.010849952697754
name:-0.00043082237243652
SIRARD; Stephen M. Patent Filings

SIRARD; Stephen M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for SIRARD; Stephen M..The latest application filed is for "stimulus responsive polymer films and formulations".

Company Profile
0.11.13
  • SIRARD; Stephen M. - Austin TX
  • Sirard; Stephen M. - San Jose CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Stimulus Responsive Polymer Films And Formulations
App 20220301859 - BLACHUT; Gregory ;   et al.
2022-09-22
Systems and methods for drying high aspect ratio structures without collapse using sacrificial bracing material that is removed using hydrogen-rich plasma
Grant 10,068,781 - Sirard , et al. September 4, 2
2018-09-04
Dry development and image transfer of si-containing self-assembled block copolymers
Grant 9,773,649 - Sirard September 26, 2
2017-09-26
Substrate freeze dry apparatus and method
Grant 9,673,037 - Sirard , et al. June 6, 2
2017-06-06
Method of collapse-free drying of high aspect ratio structures
Grant 9,666,427 - Sirard , et al. May 30, 2
2017-05-30
Dry Development And Image Transfer Of Si-containing Self-assembled Block Copolymers
App 20160141184 - Sirard; Stephen M.
2016-05-19
Systems And Methods For Drying High Aspect Ratio Structures Without Collapse Using Sacrificial Bracing Material That Is Removed Using Hydrogen-rich Plasma
App 20160097590 - Sirard; Stephen M. ;   et al.
2016-04-07
Method Of Collapse-free Drying Of High Aspect Ratio Structures
App 20140373384 - SIRARD; Stephen M. ;   et al.
2014-12-25
Delamination drying apparatus and method
Grant 8,898,928 - Sirard , et al. December 2, 2
2014-12-02
Deposition Apparatus And Method
App 20140179097 - HYMES; Diane J. ;   et al.
2014-06-26
Delamination Drying Apparatus And Method
App 20140101964 - SIRARD; Stephen M. ;   et al.
2014-04-17
Strip with reduced low-K dielectric damage
Grant 8,691,701 - Ji , et al. April 8, 2
2014-04-08
Substrate Freeze Dry Apparatus And Method
App 20120304483 - Sirard; Stephen M. ;   et al.
2012-12-06
Method for low-K dielectric etch with reduced damage
Grant 8,236,188 - Ji , et al. August 7, 2
2012-08-07
Method for dielectric material removal between conductive lines
Grant 8,114,780 - Block , et al. February 14, 2
2012-02-14
Method For Tunably Repairing Low-k Dielectric Damage
App 20110244600 - Sirard; Stephen M. ;   et al.
2011-10-06
Method for tunably repairing low-k dielectric damage
Grant 7,981,699 - Sirard , et al. July 19, 2
2011-07-19
Method For Tunably Repairing Low-k Dielectric Damage
App 20110097821 - Sirard; Stephen M. ;   et al.
2011-04-28
Method For Repairing Low-k Dielectric Damage
App 20110097904 - Sirard; Stephen M. ;   et al.
2011-04-28
Strip With Reduced Low-k Dielectric Damage
App 20100285671 - Ji; Bing ;   et al.
2010-11-11
Method For Low-k Dielectric Etch With Reduced Damage
App 20100261352 - Ji; Bing ;   et al.
2010-10-14
Method For Dielectric Material Removal Between Conductive Lines
App 20100248485 - Block; Mayumi ;   et al.
2010-09-30

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