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Patent applications and USPTO patent grants for Sirajuddin; Khalid.The latest application filed is for "post etch reactive plasma milling to smooth through substrate via sidewalls and other deeply etched features".
Patent | Date |
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Post etch reactive plasma milling to smooth through substrate via sidewalls and other deeply etched features Grant 9,039,908 - Farr , et al. May 26, 2 | 2015-05-26 |
Post etch reactive plasma milling to smooth through substrate via sidewalls and other deeply etched features App 20100055400 - Farr; Jon ;   et al. | 2010-03-04 |
Method And Apparatus Of A Substrate Etching System And Process App 20090272717 - Pamarthy; Sharma V. ;   et al. | 2009-11-05 |
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