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Patent applications and USPTO patent grants for Sinkunas; Peter J..The latest application filed is for "system and method for joining flat flexible cables".
Patent | Date |
---|---|
Vector transient reflow of lead free solder for controlling substrate warpage Grant 7,026,582 - Goenka , et al. April 11, 2 | 2006-04-11 |
System and method for joining flat flexible cables Grant 7,009,142 - Shi , et al. March 7, 2 | 2006-03-07 |
System and method for joining flat flexible cables App 20050258153 - Shi, Zhong-You (Joe) ;   et al. | 2005-11-24 |
Vector transient reflow of lead free solder for controlling substrate warpage App 20050001019 - Goenka, Lakhi N. ;   et al. | 2005-01-06 |
Flex to flex soldering by diode laser Grant 6,833,526 - Sinkunas , et al. December 21, 2 | 2004-12-21 |
Composite pallet for a vector transient reflow process App 20040134975 - Goenka, Lakhi N. ;   et al. | 2004-07-15 |
Flatwire jumper patch Grant 6,753,477 - Sinkunas , et al. June 22, 2 | 2004-06-22 |
Integrated flex substrate metallurgical bonding App 20040112935 - Sinkunas, Peter J. ;   et al. | 2004-06-17 |
Flex to flex soldering by diode laser App 20030019846 - Sinkunas, Peter J. ;   et al. | 2003-01-30 |
Circuit clip connector Grant 5,752,851 - Zaderej , et al. May 19, 1 | 1998-05-19 |
Solvent-less vapor deposition apparatus and process for application of soldering fluxes Grant 5,514,414 - Gao , et al. May 7, 1 | 1996-05-07 |
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