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name:-0.046410083770752
name:-0.02701997756958
name:-0.020631074905396
Sinha; Tuhin Patent Filings

Sinha; Tuhin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sinha; Tuhin.The latest application filed is for "system and method for validating cardiovascular parameter monitors".

Company Profile
20.25.30
  • Sinha; Tuhin - Burlingame CA
  • Sinha; Tuhin - Oradell NJ
  • Sinha; Tuhin - Hackensack NJ
  • Sinha; Tuhin - San Francisco CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
System And Method For Validating Cardiovascular Parameter Monitors
App 20220280118 - Sinha; Tuhin
2022-09-08
Method and system for cardiovascular disease assessment and management
Grant 11,424,032 - Sinha , et al. August 23, 2
2022-08-23
Optimized weight heat spreader for an electronic package
Grant 11,410,905 - Sikka , et al. August 9, 2
2022-08-09
Fatigue Failure Resistant Eletronic Package
App 20220157685 - Sikka; Kamal K. ;   et al.
2022-05-19
Method And System For Acquiring Data For Assessment Of Cardiovascular Disease
App 20220151570 - Sinha; Tuhin ;   et al.
2022-05-19
Method and system for determining cardiovascular parameters
Grant 11,324,411 - Sinha , et al. May 10, 2
2022-05-10
Stacked via rivets in chip hotspots
Grant 11,308,257 - Chidambarrao , et al. April 19, 2
2022-04-19
Method and system for acquiring data for assessment of cardiovascular disease
Grant 11,266,356 - Sinha , et al. March 8, 2
2022-03-08
Mitigating thermal-mechanical strain and warpage of an organic laminate substrate
Grant 11,239,183 - Sinha , et al. February 1, 2
2022-02-01
Electronic apparatus having inter-chip stiffener
Grant 11,211,262 - Sinha , et al. December 28, 2
2021-12-28
Crack bifurcation in back-end-of-line
Grant 11,133,268 - Sinha , et al. September 28, 2
2021-09-28
Mitigating Thermal-mechanical Strain And Warpage Of An Organic Laminate Substrate
App 20210242139 - Sinha; Tuhin ;   et al.
2021-08-05
Variable Thickness Lid Adhesive
App 20210242098 - Sinha; Tuhin ;   et al.
2021-08-05
Electronic Apparatus Having Inter-chip Stiffener
App 20210225665 - SINHA; TUHIN ;   et al.
2021-07-22
Heterogeneous Lid Seal Band for Structural Stability in Multiple Integrated Circuit (IC) Device Modules
App 20210111093 - Sinha; Tuhin ;   et al.
2021-04-15
Multi integrated circuit chip carrier package
Grant 10,978,314 - Interrante , et al. April 13, 2
2021-04-13
Method And System For Determining Cardiovascular Parameters
App 20210093210 - Sinha; Tuhin ;   et al.
2021-04-01
Spatially localized thermal interface materials
Grant 10,957,622 - Fry , et al. March 23, 2
2021-03-23
Filler particle position and density manipulation with applications in thermal interface materials
Grant 10,903,184 - Fry , et al. January 26, 2
2021-01-26
Viscoelastic pad upon integrated circuit device contact for multipass electrical characterization probe testing
Grant 10,901,030 - Cioban , et al. January 26, 2
2021-01-26
Crack Bifurcation In Back-end-of-line
App 20200373250 - SINHA; TUHIN ;   et al.
2020-11-26
Heterogeneous thermal interface material for corner and or edge degradation mitigation
Grant 10,804,181 - Interrante , et al. October 13, 2
2020-10-13
Optimized Weight Heat Spreader For An Electronic Package
App 20200303279 - Sikka; Kamal K. ;   et al.
2020-09-24
Spatially Localized Thermal Interface Materials
App 20200303282 - Fry; Jonathan R. ;   et al.
2020-09-24
Heterogeneous Thermal Interface Material for Corner and or Edge Degradation Mitigation
App 20200294880 - Interrante; Marcus E. ;   et al.
2020-09-17
Viscoelastic Pad Upon Integrated Circuit Device Contact For Multipass Electrical Characterization Probe Testing
App 20200264230 - Cioban; Max S. ;   et al.
2020-08-20
Multi Integrated Circuit Chip Carrier Package
App 20200135495 - Interrante; Marcus E. ;   et al.
2020-04-30
Filler Particle Position And Density Manipulation With Applications In Thermal Interface Materials
App 20200066669 - Fry; Jonathan ;   et al.
2020-02-27
Method and structure for flip-chip package reliability monitoring using capacitive sensors groups
Grant 10,553,503 - Davis , et al. Fe
2020-02-04
Control warpage in a semiconductor chip package
Grant 10,541,211 - Sinha , et al. Ja
2020-01-21
Multi integrated circuit chip carrier package
Grant 10,541,156 - Interrante , et al. Ja
2020-01-21
Method And System For Acquiring Data For Assessment Of Cardiovascular Disease
App 20190357855 - Sinha; Tuhin ;   et al.
2019-11-28
Method And System For Cardiovascular Disease Assessment And Management
App 20190357781 - Sinha; Tuhin ;   et al.
2019-11-28
Method and system for acquiring data for assessment of cardiovascular disease
Grant 10,420,515 - Sinha , et al. Sept
2019-09-24
Method and system for cardiovascular disease assessment and management
Grant 10,420,475 - Sinha , et al. Sept
2019-09-24
Test cell for laminate and method
Grant 10,381,276 - Iruvanti , et al. A
2019-08-13
Test cell for laminate and method
Grant 10,249,548 - Iruvanti , et al.
2019-04-02
Scanning acoustic microscope sensor array for chip-packaging interaction package reliability monitoring
Grant 10,134,649 - Davis , et al. November 20, 2
2018-11-20
Control Warpage In A Semiconductor Chip Package
App 20180301355 - Sinha; Tuhin ;   et al.
2018-10-18
Method and structure for flip-chip package reliability monitoring using capacitive sensors groups
Grant 10,068,812 - Davis , et al. September 4, 2
2018-09-04
Scanning acoustic microscope sensor array for chip-packaging interaction package reliability monitoring
Grant 10,008,427 - Davis , et al. June 26, 2
2018-06-26
Test Cell For Laminate And Method
App 20180076101 - Iruvanti; Sushumna ;   et al.
2018-03-15
Polygon die packaging
Grant 9,911,716 - Davis , et al. March 6, 2
2018-03-06
Method And Structure For Flip-chip Package Reliability Monitoring Using Capacitive Sensors Groups
App 20180047644 - Davis; Taryn J. ;   et al.
2018-02-15
Method And Structure For Flip-chip Package Reliability Monitoring Using Capacitive Sensors Groups
App 20180019172 - Davis; Taryn J. ;   et al.
2018-01-18
Method and structure for flip-chip package reliability monitoring using capacitive sensors groups
Grant 9,818,655 - Davis , et al. November 14, 2
2017-11-14
Scanning Acoustic Microscope Sensor Array For Chip-packaging Interaction Package Reliability Monitoring
App 20170271219 - Davis; Taryn J. ;   et al.
2017-09-21
Scanning Acoustic Microscope Sensor Array For Chip-packaging Interaction Package Reliability Monitoring
App 20170194221 - Davis; Taryn J. ;   et al.
2017-07-06
Test Cell For Laminate And Method
App 20170178982 - Iruvanti; Sushumna ;   et al.
2017-06-22
Method And Structure For Flip-chip Package Reliability Monitoring Using Capacitive Sensors Groups
App 20170162455 - Davis; Taryn J. ;   et al.
2017-06-08
Method And System For Acquiring Data For Assessment Of Cardiovascular Disease
App 20170065230 - Sinha; Tuhin ;   et al.
2017-03-09
Method And System For Cardiovascular Disease Assessment And Management
App 20160360980 - Sinha; Tuhin ;   et al.
2016-12-15
Polygon Die Packaging
App 20160225742 - Davis; Taryn J. ;   et al.
2016-08-04
Method and Apparatus for Privately and Securely Sharing Information Using Public Social or Sharing Network Infrastructure
App 20140289518 - Sinha; Tuhin
2014-09-25

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