| Patent | Date |
|---|
Formation of composite tungsten films
Grant 7,605,083 - Lai , et al. October 20, 2 | 2009-10-20 |
Electro-chemical deposition system
Grant 7,497,932 - Dordi , et al. March 3, 2 | 2009-03-03 |
Formation Of Composite Tungsten Films
App 20080227291 - LAI; KEN K. ; et al. | 2008-09-18 |
Formation of composite tungsten films
Grant 7,384,867 - Lai , et al. June 10, 2 | 2008-06-10 |
Semiconductor device interconnect fabricating techniques
Grant 7,312,146 - Cheung , et al. December 25, 2 | 2007-12-25 |
Plasma Dielectric Etch Process Including Ex-situ Backside Polymer Removal For Low-dielectric Constant Material
App 20070238305 - Delgadino; Gerardo A. ; et al. | 2007-10-11 |
Plasma dielectric etch process including ex-situ backside polymer removal for low-dielectric constant material
Grant 7,276,447 - Delgadino , et al. October 2, 2 | 2007-10-02 |
Controlled multi-step magnetron sputtering process
App 20070095654 - Gopalraja; Praburam ; et al. | 2007-05-03 |
Multi-frequency Plasma Enhanced Process Chamber Having A Toroidal Plasma Source
App 20070017897 - Sinha; Ashok K. ; et al. | 2007-01-25 |
Method of depositing dielectric materials including oxygen-doped silicon carbide in damascene applications
Grant 7,151,053 - Lee , et al. December 19, 2 | 2006-12-19 |
Electro-chemical deposition system
App 20060246690 - Dordi; Yezdi ; et al. | 2006-11-02 |
Semiconductor device interconnect fabricating techniques
App 20060063370 - Cheung; Robin W. ; et al. | 2006-03-23 |
Activated species generator for rapid cycle deposition processes
App 20060035025 - Verplancken; Donald J. ; et al. | 2006-02-16 |
Multi-frequency plasma enhanced process chamber having a torroidal plasma source
App 20060027329 - Sinha; Ashok K. ; et al. | 2006-02-09 |
Multi-step magnetron sputtering process
Grant 6,991,709 - Gopalraja , et al. January 31, 2 | 2006-01-31 |
Formation of composite tungsten films
App 20050287807 - Lai, Ken K. ; et al. | 2005-12-29 |
Controlled multi-step magnetron sputtering process
App 20050255700 - Gopalraja, Praburam ; et al. | 2005-11-17 |
Method of depositing dielectric materials in damascene applications
App 20050233576 - Lee, Ju-Hyung ; et al. | 2005-10-20 |
Formation of composite tungsten films
Grant 6,939,804 - Lai , et al. September 6, 2 | 2005-09-06 |
Method of delivering activated species for rapid cyclical deposition
Grant 6,905,737 - Verplancken , et al. June 14, 2 | 2005-06-14 |
Method of depositing dielectric materials in damascene applications
Grant 6,890,850 - Lee , et al. May 10, 2 | 2005-05-10 |
Multi-step magnetron sputtering process
App 20050056536 - Gopalraja, Praburam ; et al. | 2005-03-17 |
Monitoring dimensions of features at different locations in the processing of substrates
Grant 6,829,056 - Barnes , et al. December 7, 2 | 2004-12-07 |
Operating a magnetron sputter reactor in two modes
Grant 6,787,006 - Gopalraja , et al. September 7, 2 | 2004-09-07 |
Electro-chemical deposition system
App 20040084301 - Dordi, Yezdi ; et al. | 2004-05-06 |
Activated species generator for rapid cycle deposition processes
App 20040071897 - Verplancken, Donald J. ; et al. | 2004-04-15 |
Formation of composite tungsten films
App 20040014315 - Lai, Ken K. ; et al. | 2004-01-22 |
Electro-chemical deposition system
Grant 6,635,157 - Dordi , et al. October 21, 2 | 2003-10-21 |
Method of depositing dielectric materials in damascene applications
App 20030129827 - Lee, Ju-Hyung ; et al. | 2003-07-10 |
Formation of refractory metal nitrides using chemisorption techniques
App 20030049931 - Byun, Jeong Soo ; et al. | 2003-03-13 |
Electroplating apparatus using a perforated phosphorus doped consumable anode
Grant 6,503,375 - Maydan , et al. January 7, 2 | 2003-01-07 |
Method for achieving copper fill of high aspect ratio interconnect features
App 20030000844 - Carl, Daniel A. ; et al. | 2003-01-02 |
Operating a magnetron sputter reactor in two modes
App 20020185370 - Gopalraja, Praburam ; et al. | 2002-12-12 |
Integrated copper fill process
Grant 6,485,618 - Gopalraja , et al. November 26, 2 | 2002-11-26 |
Vault shaped target and magnetron operable in two sputtering modes
Grant 6,451,177 - Gopalraja , et al. September 17, 2 | 2002-09-17 |
Method for achieving copper fill of high aspect ratio interconnect features
Grant 6,436,267 - Carl , et al. August 20, 2 | 2002-08-20 |
Phosphorus doped copper
App 20020084192 - Maydan, Dan ; et al. | 2002-07-04 |
Method and apparatus for forming metal interconnects
App 20020058408 - Maydan, Dan ; et al. | 2002-05-16 |
Electro-chemical deposition system
App 20020029961 - Dordi, Yezdi ; et al. | 2002-03-14 |
Integrated copper fill process
App 20010050226 - Gopalraja, Praburam ; et al. | 2001-12-13 |
Vault shaped target and magnetron having both distributed and localized magnets
App 20010032783 - Gopalraja, Praburam ; et al. | 2001-10-25 |
Spin-rinse-drying process for electroplated semiconductor wafers
Grant 6,290,865 - Lloyd , et al. September 18, 2 | 2001-09-18 |
Integrated process for copper via filling using a magnetron and target producing highly energetic ions
Grant 6,277,249 - Gopalraja , et al. August 21, 2 | 2001-08-21 |
Integrated process for copper via filling
Grant 6,274,008 - Gopalraja , et al. August 14, 2 | 2001-08-14 |
In-situ electroless copper seed layer enhancement in an electroplating system
Grant 6,258,223 - Cheung , et al. July 10, 2 | 2001-07-10 |
Electro-chemical deposition system
Grant 6,258,220 - Dordi , et al. July 10, 2 | 2001-07-10 |
Symmetric tunable inductively coupled HDP-CVD reactor
Grant 6,170,428 - Redeker , et al. January 9, 2 | 2001-01-09 |
Remote plasma source for chamber cleaning
Grant 6,109,206 - Maydan , et al. August 29, 2 | 2000-08-29 |
Chemical vapor deposition chamber
Grant 6,103,014 - Lei , et al. August 15, 2 | 2000-08-15 |
Chemical vapor deposition chamber
Grant 5,935,338 - Lei , et al. August 10, 1 | 1999-08-10 |
Chemical vapor deposition chamber with a purge guide
Grant 5,516,367 - Lei , et al. May 14, 1 | 1996-05-14 |
Reducing backside deposition in a substrate processing apparatus through the use of a shadow ring
Grant 5,476,548 - Lei , et al. December 19, 1 | 1995-12-19 |
Compound clamp ring for semiconductor wafers
Grant 5,421,401 - Sherstinsky , et al. June 6, 1 | 1995-06-06 |
Metallization for semiconductor devices
Grant 5,356,659 - Seshubabu , et al. October 18, 1 | 1994-10-18 |
Deposition apparatus using a perforated pumping plate
Grant 5,292,554 - Sinha , et al. March 8, 1 | 1994-03-08 |
Multiple insulating layer for two-level interconnected metallization in semiconductor integrated circuit structures
Grant 4,985,373 - Levinstein , et al. January 15, 1 | 1991-01-15 |
Method and apparatus for determining characteristics of clay-bearing formations
Grant 4,953,399 - Fertl , et al. September 4, 1 | 1990-09-04 |
Fabricating a semiconductor device with low defect density oxide
Grant 4,851,370 - Doklan , et al. July 25, 1 | 1989-07-25 |
Method and apparatus for determining characteristics of clay-bearing formations
Grant 4,756,189 - Fertl , et al. July 12, 1 | 1988-07-12 |
Semiconductor integrated circuit vertical geometry impedance element
Grant 4,675,715 - Lepselter , et al. June 23, 1 | 1987-06-23 |
Method for making integrated semiconductor circuit structure with formation of Ti or Ta silicide
Grant RE32,207 - Levinstein , et al. July 15, 1 | 1986-07-15 |
Method of making semiconductor integrated circuits having backside gettered with phosphorus
Grant 4,589,928 - Dalton , et al. May 20, 1 | 1986-05-20 |
Solid state device with conductors having chain-shaped grain structure
Grant 4,438,450 - Sheng , et al. March 20, 1 | 1984-03-20 |
Cobalt silicide metallization for semiconductor integrated circuits
Grant 4,378,628 - Levinstein , et al. April 5, 1 | 1983-04-05 |
Fabrication of semiconductor devices including double annealing steps for radiation hardening
Grant 4,364,779 - Kamgar , et al. December 21, 1 | 1982-12-21 |
Method for making integrated semiconductor circuit structure with formation of Ti or Ta silicide
Grant 4,332,839 - Levinstein , et al. June 1, 1 | 1982-06-01 |
Integrated semiconductor circuit structure and method for making it
Grant 4,276,557 - Levinstein , et al. June 30, 1 | 1981-06-30 |
Fabrication of two-level polysilicon devices
Grant 4,240,196 - Jacobs , et al. December 23, 1 | 1980-12-23 |
Radial flow reactor including glow discharge limitting shield
Grant RE30,244 - Alexander, Jr. , et al. April 1, 1 | 1980-04-01 |
Hydrogen annealing process for stabilizing metal-oxide-semiconductor structures
Grant 4,151,007 - Levinstein , et al. April 24, 1 | 1979-04-24 |
Method of coating semiconductor substrates
Grant 4,142,004 - Hauser, Jr. , et al. February 27, 1 | 1979-02-27 |
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