Singh; Navneet Kumar
Patent Applications and Registrations
Patent applications and USPTO patent grants for Singh; Navneet Kumar.The latest application filed is for "type-3 printed circuit boards (pcbs) with hybrid layer counts".
- Singh; Navneet Kumar - Bangalore IN
| Patent | Date |
|---|---|
| Type-3 Printed Circuit Boards (pcbs) With Hybrid Layer Counts App 20220095456 - Rajasekar; Arumanayagam ; et al. | 2022-03-24 |
| Memory Module Connector For Thin Computing Systems App 20220077609 - SINGH; Navneet Kumar ; et al. | 2022-03-10 |
| External Cooling Solution For Mobile Computing Devices App 20210350952 - Singh; Navneet Kumar ; et al. | 2021-11-11 |
| Thermal Solutions For Package On Package (pop) Architectures App 20200312736 - SINGH; Bijendra ; et al. | 2020-10-01 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 