Singh; Navneet K.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Singh; Navneet K..The latest application filed is for "solderless or groundless electromagnetic shielding in electronic devices".

Company Profile

10.6.8

Singh; Navneet K. - Bangalore IN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Solderless Or Groundless Electromagnetic Shielding In Electronic Devices App 20220015273 - Subramanya; Bala P. ; et al.	2022-01-13
Methods of forming package structures for enhanced memory capacity and structures formed thereby Grant 10,734,393 - Singh , et al.	2020-08-04
Microelectronic interposer for a microelectronic package Grant 10,720,407 - Singh , et al.	2020-07-21
Probe connector for a probing pad structure around a thermal attach mounting hole Grant 10,656,177 - Rao , et al.	2020-05-19
Probe Connector For A Probing Pad Structure Around A Thermal Attach Mounting Hole App 20190271720 - Rao; Vikas ; et al.	2019-09-05
Electronic Device Package App 20190206839 - Balakrishnan; Ranjul ; et al.	2019-07-04
Probe connector for a probing pad structure around a thermal attach mounting hole Grant 10,317,428 - Rao , et al.	2019-06-11
Microelectronic Interposer For A Microelectronic Package App 20190109115 - Singh; Navneet K. ; et al.	2019-04-11
Methods Of Forming Package Structures For Enhanced Memory Capacity And Structures Formed Thereby App 20190074281 - Singh; Navneet K. ; et al.	2019-03-07
Microelectronic interposer for a microelectronic package Grant 10,199,353 - Singh , et al. Fe	2019-02-05
Methods of forming package structures for enhanced memory capacity and structures formed thereby Grant 10,177,161 - Singh , et al. J	2019-01-08
Methods Of Forming Package Structures For Enhanced Memory Capacity And Structures Formed Thereby App 20180182734 - Singh; Navneet K. ; et al.	2018-06-28
Probe Connector For A Probing Pad Structure Around A Thermal Attach Mounting Hole App 20180120347 - Rao; Vikas ; et al.	2018-05-03
Microelectronic Interposer For A Microelectronic Package App 20180076171 - Singh; Navneet K. ; et al.	2018-03-15

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