| Patent | Date |
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Methods And Apparatuses To Form Self-aligned Caps
App 20220270978 - Boyanov; Boyan ; et al. | 2022-08-25 |
Methods And Apparatuses To Form Self-aligned Caps
App 20200321282 - BOYANOV; Boyan ; et al. | 2020-10-08 |
Methods and apparatuses to form self-aligned caps
Grant 10,727,183 - Boyanov , et al. | 2020-07-28 |
Doric pillar supported maskless airgap structure for capacitance benefit with unlanded via solution
Grant 10,593,627 - Singh , et al. | 2020-03-17 |
Methods And Apparatuses To Form Self-aligned Caps
App 20190393157 - BOYANOV; Boyan ; et al. | 2019-12-26 |
Integrating MEMS structures with interconnects and vias
Grant 10,457,548 - Lin , et al. Oc | 2019-10-29 |
Methods and apparatuses to form self-aligned caps
Grant 10,446,493 - Boyanov , et al. Oc | 2019-10-15 |
Via self alignment and shorting improvement with airgap integration capacitance benefit
Grant 10,147,639 - Singh , et al. De | 2018-12-04 |
Method and structure to contact tight pitch conductive layers with guided vias using alternating hardmasks and encapsulating etchstop liner scheme
Grant 10,032,643 - Chawla , et al. July 24, 2 | 2018-07-24 |
Doric Pillar Supported Maskless Airgap Structure For Capacitance Benefit With Unlanded Via Solution
App 20180145035 - SINGH; Kanwal Jit ; et al. | 2018-05-24 |
Integrating Mems Structures With Interconnects And Vias
App 20180086627 - LIN; Kevin LAI ; et al. | 2018-03-29 |
Techniques for forming interconnects in porous dielectric materials
Grant 9,887,161 - Jezewski , et al. February 6, 2 | 2018-02-06 |
Method And Structure To Contact Tight Pitch Conductive Layers With Guided Vias Using Alternating Hardmasks And Encapsulating Etchstop Liner Scheme
App 20170330761 - CHAWLA; Jasmeet S. ; et al. | 2017-11-16 |
Semiconductor interconnect structures
Grant 9,754,886 - Boyanov , et al. September 5, 2 | 2017-09-05 |
Via Self Alignment And Shorting Improvement With Airgap Integration Capacitance Benefit
App 20170250104 - SINGH; Kanwal Jit ; et al. | 2017-08-31 |
Methods And Apparatuses To Form Self-aligned Caps
App 20170207120 - Boyanov; Boyan ; et al. | 2017-07-20 |
Formation Of Dram Capacitor Among Metal Interconnect
App 20170148868 - LINDERT; NICK ; et al. | 2017-05-25 |
Forming barrier walls, capping, or alloys /compounds within metal lines
Grant 9,659,869 - Jezewski , et al. May 23, 2 | 2017-05-23 |
Methods and apparatuses to form self-aligned caps
Grant 9,627,321 - Boyanov , et al. April 18, 2 | 2017-04-18 |
Formation of DRAM capacitor among metal interconnect
Grant 9,565,766 - Lindert , et al. February 7, 2 | 2017-02-07 |
Self-aligned via and plug patterning with photobuckets for back end of line (BEOL) interconnects
Grant 9,553,018 - Bristol , et al. January 24, 2 | 2017-01-24 |
Diagonal hardmasks for improved overlay in fabricating back end of line (BEOL) interconnects
Grant 9,548,269 - Myers , et al. January 17, 2 | 2017-01-17 |
Semiconductor Interconnect Structures
App 20170011998 - Boyanov; Boyan ; et al. | 2017-01-12 |
Techniques For Forming Interconnects In Porous Dielectric Materials
App 20160343665 - JEZEWSKI; CHRISTOPHER J. ; et al. | 2016-11-24 |
Semiconductor interconnect structures
Grant 9,455,224 - Boyanov , et al. September 27, 2 | 2016-09-27 |
Techniques for forming interconnects in porous dielectric materials
Grant 9,406,615 - Jezewski , et al. August 2, 2 | 2016-08-02 |
Self-aligned via patterning with multi-colored photobuckets for back end of line (BEOL) interconnects
Grant 9,406,512 - Bristol , et al. August 2, 2 | 2016-08-02 |
Methods for forming interconnect layers having tight pitch interconnect structures
Grant 9,379,010 - Jezewski , et al. June 28, 2 | 2016-06-28 |
Methods and apparatuses to form self-aligned caps
Grant 9,373,584 - Boyanov , et al. June 21, 2 | 2016-06-21 |
Diagonal Hardmasks For Improved Overlay In Fabricating Back End Of Line (beol) Interconnects
App 20160126184 - Myers; Alan M. ; et al. | 2016-05-05 |
Self-aligned Via And Plug Patterning With Photobuckets For Back End Of Line (beol) Interconnects
App 20160104642 - Bristol; Robert L. ; et al. | 2016-04-14 |
Self-aligned via and plug patterning with photobuckets for back end of line (BEOL) interconnects
Grant 9,236,342 - Bristol , et al. January 12, 2 | 2016-01-12 |
Diagonal hardmasks for improved overlay in fabricating back end of line (BEOL) interconnects
Grant 9,209,077 - Myers , et al. December 8, 2 | 2015-12-08 |
Semiconductor Interconnect Structures
App 20150294935 - Boyanov; Boyan ; et al. | 2015-10-15 |
Methods And Apparatuses To Form Self-aligned Caps
App 20150270224 - BOYANOV; Boyan ; et al. | 2015-09-24 |
Self-aligned Via Patterning With Multi-colored Photobuckets For Back End Of Line (beol) Interconnects
App 20150255284 - Bristol; Robert L. ; et al. | 2015-09-10 |
Methods For Forming Interconnect Layers Having Tight Pitch Interconnect Structures
App 20150214094 - Jezewski; Christopher J. ; et al. | 2015-07-30 |
Techniques For Forming Interconnects In Porous Dielectric Materials
App 20150179578 - Jezewski; Christopher J. ; et al. | 2015-06-25 |
Diagonal Hardmasks For Improved Overlay In Fabricating Back End Of Line (beol) Interconnects
App 20150179513 - Myers; Alan M. ; et al. | 2015-06-25 |
Self-aligned Via And Plug Patterning With Photobuckets For Back End Of Line (beol) Interconnects
App 20150171010 - Bristol; Robert L. ; et al. | 2015-06-18 |
Self-aligned Via Patterning With Multi-colored Photobuckets For Back End Of Line (beol) Interconnects
App 20150171009 - Bristol; Robert L. ; et al. | 2015-06-18 |
Self-aligned via patterning with multi-colored photobuckets for back end of line (BEOL) interconnects
Grant 9,041,217 - Bristol , et al. May 26, 2 | 2015-05-26 |
Forming Barrier Walls, Capping, Or Alloys /compounds Within Metal Lines
App 20140091467 - Jezewski; Christopher J. ; et al. | 2014-04-03 |
Fully Encapsulated Conductive Lines
App 20130292797 - Lindert; Nick ; et al. | 2013-11-07 |
Formation Of Dram Capacitor Among Metal Interconnect
App 20130271938 - Lindert; Nick ; et al. | 2013-10-17 |
Methods And Apparatuses To Form Self-aligned Caps
App 20130256899 - Boyanov; Boyan ; et al. | 2013-10-03 |
Removal chemistry for selectively etching metal hard mask
Grant 8,080,475 - RamachandraRao , et al. December 20, 2 | 2011-12-20 |
Removal Chemistry For Selectively Etching Metal Hard Mask
App 20100190347 - RamachandraRao; Vijayakumar SubramanyaRao ; et al. | 2010-07-29 |
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