loadpatents
name:-0.016670942306519
name:-0.012172937393188
name:-0.0058720111846924
Singh; Jeanne Marie Saldanha Patent Filings

Singh; Jeanne Marie Saldanha

Patent Applications and Registrations

Patent applications and USPTO patent grants for Singh; Jeanne Marie Saldanha.The latest application filed is for "thermally inkjettable acrylic dielectric ink formulation and process".

Company Profile
5.25.28
  • Singh; Jeanne Marie Saldanha - Lexington KY
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Thermally Inkjettable Acrylic Dielectric Ink Formulation And Process
App 20200325349 - Cai; Xiaorong ;   et al.
2020-10-15
Thermally inkjettable acrylic dielectric ink formulation and process
Grant 10,703,922 - Cai , et al.
2020-07-07
Thermally Inkjettable Acrylic Dielectric Ink Formulation And Process
App 20190023914 - Cai; Xiaorong ;   et al.
2019-01-24
Thermally inkjettable acrylic dielectric ink formulation and process
Grant 10,113,074 - Cai , et al. October 30, 2
2018-10-30
Laminate constructs for micro-fluid ejection devices
Grant 9,707,758 - Anderson , et al. July 18, 2
2017-07-18
Thermally Inkjettable Acrylic Dielectric Ink Formulation And Process
App 20160312049 - Cai; Xiaorong ;   et al.
2016-10-27
Laminate Constructs For Micro-fluid Ejection Devices
App 20160016406 - ANDERSON; Frank Edward ;   et al.
2016-01-21
Laminate constructs for micro-fluid ejection devices
Grant 9,144,969 - Anderson , et al. September 29, 2
2015-09-29
Spray coatable adhesive for bonding silicon dies to rigid substrates
Grant 8,785,524 - Wu , et al. July 22, 2
2014-07-22
Thermally Inkjettable Acrylic Dielectric Ink Formulation And Process
App 20140142245 - CAI; Xiaorong ;   et al.
2014-05-22
Laminate Constructs For Micro-fluid Ejection Devices
App 20140092171 - ANDERSON; Frank Edward ;   et al.
2014-04-03
Thermally inkjettable acrylic dielectric ink formulation and process
Grant 8,659,158 - Cai , et al. February 25, 2
2014-02-25
Micro-fluid ejection head
Grant 8,500,242 - Anderson , et al. August 6, 2
2013-08-06
Die Attach Composition For Silicon Chip Placement On A Flat Substrate Having Improved Thixotropic Properties
App 20120182355 - Graham; David ;   et al.
2012-07-19
Micro-Fluid Ejection Head
App 20120154486 - Anderson; Frank ;   et al.
2012-06-21
Spray Coatable Adhesive For Bonding Silicon Dies To Rigid Substrates
App 20110319513 - Wu; Xiaoming ;   et al.
2011-12-29
Modular Micro-fluid Ejection Device
App 20110316930 - Corley; Richard E. ;   et al.
2011-12-29
Method Of Restricting Chip Movement Upon Bonding To Rigid Substrate Using Spray Coatable Adhesive
App 20110318882 - Wu; Xiaoming ;   et al.
2011-12-29
Micro-fluid ejection heads with chips in pockets
Grant 8,061,811 - Anderson , et al. November 22, 2
2011-11-22
Micro-fluid ejection heads with chips in pockets
Grant 8,029,100 - Anderson , et al. October 4, 2
2011-10-04
Micro-fluid ejection devices having reduced input/output addressable heaters
Grant 7,959,261 - Anderson , et al. June 14, 2
2011-06-14
Composite ceramic substrate for micro-fluid ejection head
Grant 7,937,835 - Anderson , et al. May 10, 2
2011-05-10
Ink jetting structure having protected connections
Grant 7,784,909 - Anderson , et al. August 31, 2
2010-08-31
Micro-Fluid Ejection Heads with Chips in Pockets
App 20100199497 - Anderson; Frank Edward ;   et al.
2010-08-12
Composite Ceramic Substrate for Micro-Fluid Ejection Head
App 20100132874 - Anderson; Frank Edward ;   et al.
2010-06-03
Tunable Dielectric Compositions and Methods
App 20100098838 - Cai; Xiaorong ;   et al.
2010-04-22
Composite ceramic substrate for micro-fluid ejection head
Grant 7,681,991 - Anderson , et al. March 23, 2
2010-03-23
Printing of multi-layer circuits
Grant 7,624,500 - Cai , et al. December 1, 2
2009-12-01
Internal vent channel in ejection head assemblies and methods relating thereto
Grant 7,600,850 - Blackburn , et al. October 13, 2
2009-10-13
Composite Ceramic Substrate For Micro-Fluid Ejection Head
App 20080299361 - Anderson; Frank Edward ;   et al.
2008-12-04
Micro-Fluid Ejection Devices Having Reduced Input/Output Addressable Heaters
App 20080278542 - Anderson; Frank Edward ;   et al.
2008-11-13
Customizable electroluminescent displays
Grant 7,425,795 - Anderson , et al. September 16, 2
2008-09-16
Printing Of Multi-layer Circuits
App 20080084449 - Cai; Xiaorong ;   et al.
2008-04-10
Thermally Inkjettable Acrylic Dielectric Ink Formulation And Process
App 20080085369 - Cai; Xiaorong ;   et al.
2008-04-10
Micro-Fluid Ejection Heads with Chips in Pockets
App 20080079776 - Anderson; Frank Edward ;   et al.
2008-04-03
Tunable Dielectric Compositions And Methods
App 20080075863 - Cai; Xiaorong ;   et al.
2008-03-27
Gradient Layers In Multi-layer Circuits And Methods And Circuits Related To The Same
App 20080044631 - Sacoto; Paul ;   et al.
2008-02-21
Methods and Apparatuses for Applying a Protective Material to an Interconnect Associated with a Component
App 20070232055 - Corley; Richard Earl ;   et al.
2007-10-04
Internal vent channel in ejection head assemblies and methods relating thereto
App 20070206067 - Blackburn; Jonathan Michael ;   et al.
2007-09-06
Laser welded inkjet printheads having non-uniformly thick printhead lids
Grant 7,195,348 - Buchanan , et al. March 27, 2
2007-03-27
Customizable electroluminescent displays
App 20070046197 - Anderson; Frank Edward ;   et al.
2007-03-01
Manufacturing method for ink jet pen
Grant 7,018,503 - Murthy , et al. March 28, 2
2006-03-28
Compensation plates and compliant members for laser welding a non-uniformly thick work piece including inkjet printheads with non-uniformly thick printhead lids
Grant 6,841,024 - Drummond , et al. January 11, 2
2005-01-11
Method and apparatus for adhesively securing ink jet pen components using thin film adhesives
Grant 6,758,934 - Singh , et al. July 6, 2
2004-07-06
Compensation plates and compliant members for laser welding a non-uniformly thick work piece including inkjet printheads with non-uniformly thick printhead lids
App 20040080573 - Buchanan, Jeffery James ;   et al.
2004-04-29
Manufacturing method for ink jet pen
App 20030188827 - Murthy, Ashok ;   et al.
2003-10-09
Manufacturing method for ink jet pen
Grant 6,612,032 - Murthy , et al. September 2, 2
2003-09-02
Method and apparatus for adhesively securing ink jet pen components using thin film adhesives
App 20030131930 - Singh, Jeanne Marie Saldanha ;   et al.
2003-07-17
Tab circuit design for simplified use with hot bar soldering technique
Grant 6,357,864 - Sullivan , et al. March 19, 2
2002-03-19

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