Patent | Date |
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Thermally Inkjettable Acrylic Dielectric Ink Formulation And Process App 20200325349 - Cai; Xiaorong ;   et al. | 2020-10-15 |
Thermally inkjettable acrylic dielectric ink formulation and process Grant 10,703,922 - Cai , et al. | 2020-07-07 |
Thermally Inkjettable Acrylic Dielectric Ink Formulation And Process App 20190023914 - Cai; Xiaorong ;   et al. | 2019-01-24 |
Thermally inkjettable acrylic dielectric ink formulation and process Grant 10,113,074 - Cai , et al. October 30, 2 | 2018-10-30 |
Laminate constructs for micro-fluid ejection devices Grant 9,707,758 - Anderson , et al. July 18, 2 | 2017-07-18 |
Thermally Inkjettable Acrylic Dielectric Ink Formulation And Process App 20160312049 - Cai; Xiaorong ;   et al. | 2016-10-27 |
Laminate Constructs For Micro-fluid Ejection Devices App 20160016406 - ANDERSON; Frank Edward ;   et al. | 2016-01-21 |
Laminate constructs for micro-fluid ejection devices Grant 9,144,969 - Anderson , et al. September 29, 2 | 2015-09-29 |
Spray coatable adhesive for bonding silicon dies to rigid substrates Grant 8,785,524 - Wu , et al. July 22, 2 | 2014-07-22 |
Thermally Inkjettable Acrylic Dielectric Ink Formulation And Process App 20140142245 - CAI; Xiaorong ;   et al. | 2014-05-22 |
Laminate Constructs For Micro-fluid Ejection Devices App 20140092171 - ANDERSON; Frank Edward ;   et al. | 2014-04-03 |
Thermally inkjettable acrylic dielectric ink formulation and process Grant 8,659,158 - Cai , et al. February 25, 2 | 2014-02-25 |
Micro-fluid ejection head Grant 8,500,242 - Anderson , et al. August 6, 2 | 2013-08-06 |
Die Attach Composition For Silicon Chip Placement On A Flat Substrate Having Improved Thixotropic Properties App 20120182355 - Graham; David ;   et al. | 2012-07-19 |
Micro-Fluid Ejection Head App 20120154486 - Anderson; Frank ;   et al. | 2012-06-21 |
Spray Coatable Adhesive For Bonding Silicon Dies To Rigid Substrates App 20110319513 - Wu; Xiaoming ;   et al. | 2011-12-29 |
Modular Micro-fluid Ejection Device App 20110316930 - Corley; Richard E. ;   et al. | 2011-12-29 |
Method Of Restricting Chip Movement Upon Bonding To Rigid Substrate Using Spray Coatable Adhesive App 20110318882 - Wu; Xiaoming ;   et al. | 2011-12-29 |
Micro-fluid ejection heads with chips in pockets Grant 8,061,811 - Anderson , et al. November 22, 2 | 2011-11-22 |
Micro-fluid ejection heads with chips in pockets Grant 8,029,100 - Anderson , et al. October 4, 2 | 2011-10-04 |
Micro-fluid ejection devices having reduced input/output addressable heaters Grant 7,959,261 - Anderson , et al. June 14, 2 | 2011-06-14 |
Composite ceramic substrate for micro-fluid ejection head Grant 7,937,835 - Anderson , et al. May 10, 2 | 2011-05-10 |
Ink jetting structure having protected connections Grant 7,784,909 - Anderson , et al. August 31, 2 | 2010-08-31 |
Micro-Fluid Ejection Heads with Chips in Pockets App 20100199497 - Anderson; Frank Edward ;   et al. | 2010-08-12 |
Composite Ceramic Substrate for Micro-Fluid Ejection Head App 20100132874 - Anderson; Frank Edward ;   et al. | 2010-06-03 |
Tunable Dielectric Compositions and Methods App 20100098838 - Cai; Xiaorong ;   et al. | 2010-04-22 |
Composite ceramic substrate for micro-fluid ejection head Grant 7,681,991 - Anderson , et al. March 23, 2 | 2010-03-23 |
Printing of multi-layer circuits Grant 7,624,500 - Cai , et al. December 1, 2 | 2009-12-01 |
Internal vent channel in ejection head assemblies and methods relating thereto Grant 7,600,850 - Blackburn , et al. October 13, 2 | 2009-10-13 |
Composite Ceramic Substrate For Micro-Fluid Ejection Head App 20080299361 - Anderson; Frank Edward ;   et al. | 2008-12-04 |
Micro-Fluid Ejection Devices Having Reduced Input/Output Addressable Heaters App 20080278542 - Anderson; Frank Edward ;   et al. | 2008-11-13 |
Customizable electroluminescent displays Grant 7,425,795 - Anderson , et al. September 16, 2 | 2008-09-16 |
Printing Of Multi-layer Circuits App 20080084449 - Cai; Xiaorong ;   et al. | 2008-04-10 |
Thermally Inkjettable Acrylic Dielectric Ink Formulation And Process App 20080085369 - Cai; Xiaorong ;   et al. | 2008-04-10 |
Micro-Fluid Ejection Heads with Chips in Pockets App 20080079776 - Anderson; Frank Edward ;   et al. | 2008-04-03 |
Tunable Dielectric Compositions And Methods App 20080075863 - Cai; Xiaorong ;   et al. | 2008-03-27 |
Gradient Layers In Multi-layer Circuits And Methods And Circuits Related To The Same App 20080044631 - Sacoto; Paul ;   et al. | 2008-02-21 |
Methods and Apparatuses for Applying a Protective Material to an Interconnect Associated with a Component App 20070232055 - Corley; Richard Earl ;   et al. | 2007-10-04 |
Internal vent channel in ejection head assemblies and methods relating thereto App 20070206067 - Blackburn; Jonathan Michael ;   et al. | 2007-09-06 |
Laser welded inkjet printheads having non-uniformly thick printhead lids Grant 7,195,348 - Buchanan , et al. March 27, 2 | 2007-03-27 |
Customizable electroluminescent displays App 20070046197 - Anderson; Frank Edward ;   et al. | 2007-03-01 |
Manufacturing method for ink jet pen Grant 7,018,503 - Murthy , et al. March 28, 2 | 2006-03-28 |
Compensation plates and compliant members for laser welding a non-uniformly thick work piece including inkjet printheads with non-uniformly thick printhead lids Grant 6,841,024 - Drummond , et al. January 11, 2 | 2005-01-11 |
Method and apparatus for adhesively securing ink jet pen components using thin film adhesives Grant 6,758,934 - Singh , et al. July 6, 2 | 2004-07-06 |
Compensation plates and compliant members for laser welding a non-uniformly thick work piece including inkjet printheads with non-uniformly thick printhead lids App 20040080573 - Buchanan, Jeffery James ;   et al. | 2004-04-29 |
Manufacturing method for ink jet pen App 20030188827 - Murthy, Ashok ;   et al. | 2003-10-09 |
Manufacturing method for ink jet pen Grant 6,612,032 - Murthy , et al. September 2, 2 | 2003-09-02 |
Method and apparatus for adhesively securing ink jet pen components using thin film adhesives App 20030131930 - Singh, Jeanne Marie Saldanha ;   et al. | 2003-07-17 |
Tab circuit design for simplified use with hot bar soldering technique Grant 6,357,864 - Sullivan , et al. March 19, 2 | 2002-03-19 |