loadpatents
Patent applications and USPTO patent grants for Singh; Amrik.The latest application filed is for "electrolytic generation of manganese (iii) ions in strong sulfuric acid".
Patent | Date |
---|---|
Electrolytic generation of manganese (III) ions in strong sulfuric acid Grant 10,895,016 - Pearson , et al. January 19, 2 | 2021-01-19 |
Electrolytic Generation of Manganese (III) Ions in Strong Sulfuric Acid App 20170067176 - Pearson; Trevor ;   et al. | 2017-03-09 |
Electrolytic generation of manganese (III) ions in strong sulfuric acid Grant 9,534,306 - Pearson , et al. January 3, 2 | 2017-01-03 |
Electrolytic Generation of Manganese (III) Ions in Strong Sulfuric Acid App 20130186862 - Pearson; Trevor ;   et al. | 2013-07-25 |
Method of electrolessly depositing metal on the walls of through-holes Grant 7,858,146 - Poole , et al. December 28, 2 | 2010-12-28 |
Temporary window covering Grant 7,665,500 - Rossato , et al. February 23, 2 | 2010-02-23 |
Electroless copper compositions Grant 7,611,569 - Poole , et al. November 3, 2 | 2009-11-03 |
Electroless copper and redox couples Grant 7,527,681 - Poole , et al. May 5, 2 | 2009-05-05 |
Formaldehyde free electroless copper compositions Grant 7,501,014 - Poole , et al. March 10, 2 | 2009-03-10 |
Electroless methods App 20090004382 - Poole; Mark A. ;   et al. | 2009-01-01 |
Electroless copper and redox couples App 20080038449 - Poole; Mark A. ;   et al. | 2008-02-14 |
Formaldehyde free electroless copper compositions App 20080038451 - Poole; Mark A. ;   et al. | 2008-02-14 |
Electroless copper compositions App 20080038452 - Poole; Mark A. ;   et al. | 2008-02-14 |
Environmentally friendly electroless copper compositions App 20080038450 - Poole; Mark A. ;   et al. | 2008-02-14 |
Temporary Window Covering App 20080023153 - Rossato; Alejandro ;   et al. | 2008-01-31 |
Temporary window covering Grant 7,255,149 - Rossato , et al. August 14, 2 | 2007-08-14 |
Temporary window covering App 20040182521 - Rossato, Alejandro ;   et al. | 2004-09-23 |
Combined adhesion promotion and direct metallization process Grant 6,790,334 - Begum , et al. September 14, 2 | 2004-09-14 |
Combined adhesion promotion and direct metallization process App 20030047458 - Begum, Zatoon ;   et al. | 2003-03-13 |
Process for multilayer printed circuit board manufacture Grant 5,106,454 - Allardyce , et al. April 21, 1 | 1992-04-21 |
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