loadpatents
Patent applications and USPTO patent grants for Singh; Akhilesh Kumar.The latest application filed is for "packaged semiconductor device assembly".
Patent | Date |
---|---|
Packaged Semiconductor Device Assembly App 20220093499 - Singh; Akhilesh Kumar ;   et al. | 2022-03-24 |
Package with conductive underfill ground plane Grant 11,270,972 - Lakhera , et al. March 8, 2 | 2022-03-08 |
Hybrid package Grant 11,189,557 - Singh , et al. November 30, 2 | 2021-11-30 |
Package With Conductive Underfill Ground Plane App 20200395332 - LAKHERA; Nishant ;   et al. | 2020-12-17 |
Hybrid Package App 20200185319 - Singh; Akhilesh Kumar ;   et al. | 2020-06-11 |
Hybrid Package App 20200013711 - Singh; Akhilesh Kumar ;   et al. | 2020-01-09 |
Package with support structure Grant 10,431,534 - Lakhera , et al. O | 2019-10-01 |
Package With Support Structure App 20190181079 - Lakhera; Nishant ;   et al. | 2019-06-13 |
Package With Isolation Structure App 20190157222 - LAKHERA; Nishant ;   et al. | 2019-05-23 |
Selectively Shielded Semiconductor Package App 20190103365 - SINGH; Akhilesh Kumar ;   et al. | 2019-04-04 |
Electronic Component Package With Heatsink And Multiple Electronic Components App 20180114745 - ORATTI KALANDAR; NAVAS KHAN ;   et al. | 2018-04-26 |
Electronic component package with heatsink and multiple electronic components Grant 9,953,904 - Oratti Kalandar , et al. April 24, 2 | 2018-04-24 |
Stackable Molded Packages And Methods Of Manufacture Thereof App 20180053753 - Singh; Akhilesh Kumar ;   et al. | 2018-02-22 |
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