Singh; Akhilesh K.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Singh; Akhilesh K..The latest application filed is for "apparatus and methods for multi-die packaging".
- Singh; Akhilesh K. - Austin TX
| Patent | Date |
|---|---|
| Die attachment for packaged semiconductor device Grant 10,217,698 - Singh , et al. Feb | 2019-02-26 |
| Apparatus and methods for multi-die packaging Grant 10,211,184 - Lakhera , et al. Feb | 2019-02-19 |
| Wafer level chip scale package with encapsulant Grant 10,147,645 - Oratti Kalandar , et al. De | 2018-12-04 |
| Structure and method to minimize warpage of packaged semiconductor devices Grant 9,978,614 - Lakhera , et al. May 22, 2 | 2018-05-22 |
| Apparatus And Methods For Multi-die Packaging App 20180053749 - LAKHERA; Nishant ; et al. | 2018-02-22 |
| Apparatus and Methods for Multi-Die Packaging App 20170278825 - LAKHERA; Nishant ; et al. | 2017-09-28 |
| Method for packaging an integrated circuit device with stress buffer Grant 9,691,637 - Oratti Kalandar , et al. June 27, 2 | 2017-06-27 |
| Method For Packaging An Integrated Circuit Device With Stress Buffer App 20170103905 - ORATTI KALANDAR; NAVAS KHAN ; et al. | 2017-04-13 |
| Die Attachment For Packaged Semiconductor Device App 20170098597 - SINGH; AKHILESH K. ; et al. | 2017-04-06 |
| Wafer Level Chip Scale Package With Encapsulant App 20170084491 - ORATTI KALANDAR; NAVAS KHAN ; et al. | 2017-03-23 |
| Die attachment for packaged semiconductor device Grant 9,559,077 - Singh , et al. January 31, 2 | 2017-01-31 |
| Apparatus and methods for stackable packaging Grant 9,508,632 - Oratti Kalandar , et al. November 29, 2 | 2016-11-29 |
| Structure And Method To Minimize Warpage Of Packaged Semiconductor Devices App 20160307780 - LAKHERA; Nishant ; et al. | 2016-10-20 |
| Environmental Sensor Structure App 20160130136 - SINGH; AKHILESH K. ; et al. | 2016-05-12 |
| Die Attachment For Packaged Semiconductor Device App 20160118365 - SINGH; AKHILESH K. ; et al. | 2016-04-28 |
| Structure And Method To Minimize Warpage Of Packaged Semiconductor Devices App 20160064299 - LAKHERA; NISHANT ; et al. | 2016-03-03 |
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